Design, fabrication and measurement results of single grain (SG) lateral PIN photodiodes and SG thin film transistors (TFT) are reported in this paper. Devices were developed to be used in indirect X-ray image sensor pixel design. We have controlled position of 6 μm x 6 μm silicon grains with excimer-laser crystallization of a-Si film. Lateral PIN photodiode (PD) arrays were designed inside the single grain with 1 μm, 1.5 μm and 2 μm intrinsic region length and 4 μm width. The gate length and the width of the fabricated TFTs are 1.5 μm and 4 μm, respectively. Devices were fabricated using a-Si, SOI and crystalline silicon layers and electrical measurement results were compared. 100 μm x 100 μm sizes SG-photodiodes have dark and saturation currents on the order of 0.1 nA and 10 nA resulting in a light sensitivity of 200 with an exposure of white light. Fabricated NMOS and PMOS TFTs inside the grains have field effect mobility of 526 cm 2 /Vs and 253 cm 2 /Vs, respectively.