Friction and adhesion properties of fluorocarbon polymer thin films prepared by magnetron sputtering

Iwamori, Satoru; Hasegawa, Norihiko; Uemura, Akiko; Tanabe, Tomoya; Nishiyama, Itsuo

doi:10.1016/j.vacuum.2009.04.044

Cited by 22 publications

(17 citation statements)

References 8 publications

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“…We also reported the fluorocarbon thin films prepared by the r.f. sputtering showed good adhesion between SUS302 plate [24] and Cu thin film prepared by vacuum evaporation [25]. Fluorine or fluorocarbon molecules have strong affinity for Cu atom as the difference of electronegativity between fluorine atom and Cu atom is large, which affects adhesion strength between the fluorocarbon thin film and Cu thin film.…”

Section: Effect Of the Cu Interfacial Layer On The Adhesion And Wear mentioning

confidence: 99%

Effects of copper interfacial layer on surface characteristics, adhesion and wear durability of fluorocarbon thin film sputtered onto polyimide film substrate

Seino

Sasaki

Owashi

et al. 2015

Vacuum

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Section: Effect Of the Cu Interfacial Layer On The Adhesion And Wear mentioning

confidence: 99%

Effects of copper interfacial layer on surface characteristics, adhesion and wear durability of fluorocarbon thin film sputtered onto polyimide film substrate

Seino

Sasaki

Owashi

et al. 2015

Vacuum

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“…The peel testing on a small area was conducted using a SAICAS (Nagai et al, 2002;Oyane et al, 2009;Saito et al, 2009Saito et al, , 2012Iwamori et al, 2010). The blade was made of diamond and had a width of 0.1 mm.…”

Section: Measurement Of the Peel Strength Using Saicasmentioning

confidence: 99%

“…This force indicates the peel strength between the Cu trace and the epoxy resin, as shown Figure 4(b). The peel strength (P), and shear stress (t), can be, respectively, expressed as Nagai et al (2002), Saito et al (2009) and Iwamori et al (2010):…”

Section: Measurement Of the Peel Strength Using Saicasmentioning

confidence: 99%

Evaluation of the peel strength in Cu/epoxy thin film using a novel interfacial cutting method

Huh

Kim²,

Kim³

2014

Circuit World

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Purpose -The purpose of this paper is to evaluate the relationship between the Cu trace and epoxy resin and to check the validity of surface and interfacial cutting analysis system (SAICAS) by comparing its results to those of the 908 peel test. Design/methodology/approach -In this study, the effects of surface morphology on the adhesion strength were studied for a Cu/epoxy resin system using a SAICAS. In order to evaluate the peel strength of the sample, the curing degree and surface morphology of the epoxy resin were varied in the Cu/epoxy resin system. Findings -The results indicated that the peel strength is strongly affected by the curing degree and the surface morphology of the epoxy layer. As the pre-cure time increased, the interactions between the epoxy resin and permanganate during the adhesion promotion process decreased, which decreased the surface roughness (Ra) of the resin. Therefore, the surface roughness of the epoxy resin decreased with increasing pre-cure time. The curing degree was calculated with the FTIR absorption peak (910 cm 2 1 ) of the epoxy groups. The high curing degree for the epoxy resin results in a coral-like morphology that provides a better anchoring effect for the Cu trace and a higher interfacial strength.Research limitations/implications -It is necessary to study the further adhesion strength, i.e. the friction energy, the plastic deformation energy, and the interfacial fracture energy, in micro-and nanoscale areas using SAICAS owing to insufficient data regarding the effects of size and electroplating materials. Originality/value -From findings, it is found that measuring the peel strength using SAICAS is particularly useful because it makes the assessment of the peel strength in the Cu/epoxy resin system of electronic packages possible.

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“…sputtering (in this case via a magnetron) and tested using the pin on disc technique, that both wear resistance and coefficient of friction increased with the magnetic field strength of the sputterer. 110 Tests conducted using a friction abrasion analyser showed that the hydrophobicity of fluorinated carbon film coated surfaces degraded rapidly with wear. As these films have a low surface energy, they generally have low coefficients of friction which are usually desirable.…”

Section: Solid Interactions 21 Wear Mechanismsmentioning

confidence: 99%

Degradation of polymer films

Cheneler

Bowen

2013

Soft Matter

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In this review paper the current state of research into the physical degradation of polymer films is elucidated. Modern applications of polymer films and the implication of their degradation are discussed. Recent investigations into solid interactions such as abrasion, adhesion, fatigue and other failure modes as well as plasma and photonic interactions are examined. This investigation highlights key degradation mechanisms as well as areas where controversy over these mechanisms lies, and suggests directions for future research.

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Friction and adhesion properties of fluorocarbon polymer thin films prepared by magnetron sputtering

Cited by 22 publications

References 8 publications

Effects of copper interfacial layer on surface characteristics, adhesion and wear durability of fluorocarbon thin film sputtered onto polyimide film substrate

Effects of copper interfacial layer on surface characteristics, adhesion and wear durability of fluorocarbon thin film sputtered onto polyimide film substrate

Evaluation of the peel strength in Cu/epoxy thin film using a novel interfacial cutting method

Degradation of polymer films

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