Low-temperature solution-processed
inorganic–organic hybrid gate dielectrics are considered as
emerging candidates for future low-cost flexible electronic devices,
which are alternatives to high-temperature inorganic-based gate dielectric
materials. In the present work, we developed a novel inorganic–organic
HfO2–PMMA hybrid dielectric material by an efficient
eco-friendly sol–gel method, deposited by spin-coating technique
and converted into dielectric thin films at a very low thermal annealing
temperature of 185 °C. The HfO2–PMMA hybrid
thin-film formation was systematically investigated by FTIR and XPS
techniques. Subsequently, a very low surface roughness of 0.8 nm and
high uniformity of hybrid thin films were observed by tapping-mode
AFM. Also, the thin films showed a hydrophilic nature with a high
surface energy of 59.9 mJ/m2 as observed by the contact
angle technique. The insulating properties of this hybrid film, studied
by C–V and I–V measurements,
showed very low leakage current density under 1 nA/cm2 at
−5 V, high gate capacitance of 106 nF/cm2, and high
dielectric constant of 11.3 at 1 kHz. With such dielectric properties,
the hybrid thin films were tried as dielectric gate layers in room-temperature-sputtered
ZnO thin-film transistors (TFTs). As-fabricated devices achieved low
operating voltage, less than 5 V, with high saturation field effect
mobility of 15.5 cm2 V–1 s–1, very low threshold voltage of 0.5 V, high on/off current ratio
of 106, and low subthreshold slope of 0.37 V/dec. These
results reveal the promising application of the HfO2–PMMA
hybrid material as the gate dielectric for the fabrication of ZnO-based
TFTs at low temperature.