2009
DOI: 10.1017/cbo9781139195065
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Fundamentals of Modern VLSI Devices

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Cited by 1,590 publications
(1,268 citation statements)
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References 368 publications
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“…The aggressive scaling-down of MOSFETs in the deep submicrometer domain requires ultrathin oxides and density-of-states) [15][16], such that the lowest of the allowed energy levels for electrons (resp. for holes) in the well does not coincide with the bottom of the conduction band (resp.…”
Section: Quantum Confinement Effectsmentioning
confidence: 99%
“…The aggressive scaling-down of MOSFETs in the deep submicrometer domain requires ultrathin oxides and density-of-states) [15][16], such that the lowest of the allowed energy levels for electrons (resp. for holes) in the well does not coincide with the bottom of the conduction band (resp.…”
Section: Quantum Confinement Effectsmentioning
confidence: 99%
“…The current generated from the reverse biased junction becomes negligible compared with the current that flows through the channel and changes the current-voltage characteristic (Eq. (6) [25][26][27]). …”
Section: Methods Of Quality Factor Tuningmentioning
confidence: 99%
“…(6) to Eq. (7) [25][26][27] (again, V GS , V T , and V DS are the primary parameters to focus on to understand the transistor behavior).…”
Section: Methods Of Quality Factor Tuningmentioning
confidence: 99%
“…S does not notably degrade as the doping concentration increases but is tied to a plausibly small value near 60 mV=dec, the theoretical limit in the presence of thermionic emission at 300 K, at doping concentrations of 10 19 cm −3 and below. S (mV=dec) is defined as 29) S ¼ ln 10 Á mkT q…”
Section: Device Structure and Simulation Approachmentioning
confidence: 99%