2019
DOI: 10.7567/1882-0786/ab023c
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GaN-on-Si resonant-cavity light-emitting diode incorporating top and bottom dielectric distributed Bragg reflectors

Abstract: We report here a GaN-based resonant cavity light-emitting diode (RCLED) with top and bottom dielectric TiO 2 /SiO 2 distributed Bragg reflector (DBR) mirrors on a silicon substrate. High data transmission in free space at 200 Mbps with an opening in the eye diagram was achieved. The results show that the combination of GaN-based LED on silicon and double sided dielectric DBR mirror deposition enables a manufacturable process which provides a unique opportunity for commercialization of RCLED in future solid-sta… Show more

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Cited by 15 publications
(12 citation statements)
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“…In the flip-chip and substrate removal process, a dielectric DBR is firstly deposited on the as-grown surface side (or p-type side), followed by wafer bonding to a handling wafer. Substrate removal can be accomplished by laser-induced liftoff (LLO) [20], photoelectrochemical (PEC) etching of a sacrificial layer [84], wet/dry etching [85], or chemo-mechanical polishing (CMP) [86]. LLO was developed in 1999 [87] to separate GaN LEDs from a sapphire substrate with the back-side irradiation of an excimer laser.…”
Section: Dielectric Dbrs Through Substrate Removalmentioning
confidence: 99%
“…In the flip-chip and substrate removal process, a dielectric DBR is firstly deposited on the as-grown surface side (or p-type side), followed by wafer bonding to a handling wafer. Substrate removal can be accomplished by laser-induced liftoff (LLO) [20], photoelectrochemical (PEC) etching of a sacrificial layer [84], wet/dry etching [85], or chemo-mechanical polishing (CMP) [86]. LLO was developed in 1999 [87] to separate GaN LEDs from a sapphire substrate with the back-side irradiation of an excimer laser.…”
Section: Dielectric Dbrs Through Substrate Removalmentioning
confidence: 99%
“…However, due to their inherent narrow energy gap, the applicable wavelength of the devices is significantly limited. Compared to AlInGaP material, light emitted by InGaN/GaN semiconductors can cover the entire visible light range [12][13][14][15][16][17] [18], Thus, blue, green, and red can be integrated into one chip with the same material system. In 2008, utilizing a selective area growth method, a white light-emitting diode (LED) was fabricated with laterally distributed blue and green InGaN/GaN multiple quantum wells (MQWs).…”
Section: Indexmentioning
confidence: 99%
“…[ 33 ] Professor Bao‐Ping Zhang group from Xiamen University fabricated vertical‐structured Fabry–Perot cavity on Si substrate by metal bonding technique; [ 34 ] Yongjin Wang group from Nanjing university of Posts and Telecommunications and Professor Amano from Japan Nagoya University Hiroshi deposit TiO 2 /SiO 2 DBR on top and bottom for RC micro‐LEDs. [ 35 ]…”
Section: Approaches For Improving Led Modulation Bandwidthmentioning
confidence: 99%