2014
DOI: 10.7567/jjap.53.04ed14
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Gate-all-around floating-gate memory device with triangular poly-Si nanowire channels

Abstract: A novel gate-all-around (GAA) poly-Si floating-gate (FG) memory device with triangular nanowire (NW) channels was fabricated and characterized in this work. The enhanced electric field around the corners of the NW channels boosts more electrons tunneling through the tunnel oxide layer during programming and erasing (P/E) processes, and thus the operation voltage markedly decreases. Furthermore, the nonlocalized trapping feature characteristic of the FG makes the injection of electrons easier during the program… Show more

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Cited by 5 publications
(1 citation statement)
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“…[1][2][3] Various concepts for flash memories have been proposed to achieve high density. [4][5][6][7][8][9] However, the scaling limitation and manufacturing difficulties will be confronted in the near future for conventional NAND technology. In order to overcome these problems, several three-dimensional (3D) technologies, such as Bit-Cost Scalable (BiCS), [10][11][12][13][14][15][16][17][18] SMArT 19,20) and terabit cell array transistor (TCAT) flash technologies, 13,21,22) have been introduced.…”
Section: Introductionmentioning
confidence: 99%
“…[1][2][3] Various concepts for flash memories have been proposed to achieve high density. [4][5][6][7][8][9] However, the scaling limitation and manufacturing difficulties will be confronted in the near future for conventional NAND technology. In order to overcome these problems, several three-dimensional (3D) technologies, such as Bit-Cost Scalable (BiCS), [10][11][12][13][14][15][16][17][18] SMArT 19,20) and terabit cell array transistor (TCAT) flash technologies, 13,21,22) have been introduced.…”
Section: Introductionmentioning
confidence: 99%