2015
DOI: 10.1109/tmtt.2015.2478000
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Generic Electrostatic Discharges Protection Solutions for RF and Millimeter-Wave Applications

Abstract: The vertical shrinkage of the advanced CMOS processes thicknesses makes electrostatic discharge (ESD) issues become more significant. RF and millimeter-wave (mm-wave) circuits are very sensitive to the ESD components' capacitive parasitic effect. Surface area is a key factor as well in an ESD protection circuit for mm-wave applications. This paper presents silicon-verified ESD solutions, which fulfill physical dimensions, ESD robustness, and broadband frequencies requirements

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Cited by 8 publications
(1 citation statement)
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“…The circuitry consists of a pair of high-side and low-side diodes that direct the ESD current from input/ output (IO) pins to power supply (VDD) and ground rail (GND). The ESD discharging path between VDD and GND, formed by the primary ESD cell, is shared by two or more IO pins [22,23,24]. When multiple IO pins share one primary ESD cell, total chip area consumed by ESD circuits is reduced.…”
Section: Introductionmentioning
confidence: 99%
“…The circuitry consists of a pair of high-side and low-side diodes that direct the ESD current from input/ output (IO) pins to power supply (VDD) and ground rail (GND). The ESD discharging path between VDD and GND, formed by the primary ESD cell, is shared by two or more IO pins [22,23,24]. When multiple IO pins share one primary ESD cell, total chip area consumed by ESD circuits is reduced.…”
Section: Introductionmentioning
confidence: 99%