Generic thermal analysis for phone and tablet systems

Gurrum, Siva P.; Edwards, D.; Marchand-Golder, Thomas; Akiyama, Jotaro; Yokoya, Satoshi; Drouard, Jean-Francois; Dahan, Franck

doi:10.1109/ectc.2012.6249032

Cited by 31 publications

(18 citation statements)

References 3 publications

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“…However, the thermal resistance network built in [18] is oversimplified as each component is modeled as one block with a single uniform temperature value. Gurrum et al modeled the smartphone in CFD tools and analyzed the thermal effect of using materials with different thermal conductivities through CFD simulation [3]. Rajmond and Fodor [4] used CFD tools to show that attaching thermal pad on top of the AP significantly reduces the AP temperature.…”

Section: Related Workmentioning

confidence: 99%

“…Several researches have been conducted in studying the thermal design for smartphones and tablets [3][4] [18]. Luo et al established a simple thermal resistance network to analyze the whole mobile phone system [18].…”

Section: Related Workmentioning

confidence: 99%

“…In smartphones, application processors (APs) incorporate CPU, GPU, digital signal processor (DSP), sometimes a baseband radio unit, and so on. The AP is a major heat generator in the smartphone [3]. Due to the cost, form factor, noise, and safety issues, smartphones rely on passive cooling methods that dissipate the heat generated by the AP through thermal conduction to the device skin.…”

Section: Introductionmentioning

confidence: 99%

“…Due to the cost, form factor, noise, and safety issues, smartphones rely on passive cooling methods that dissipate the heat generated by the AP through thermal conduction to the device skin. Thermal pads are usually attached on top of the AP chip package to ease the heat removal [3] [4]. Thermal management techniques, such as frequency throttling and voltage/frequency scaling, are also exploited to avoid high die temperatures.…”

Section: Introductionmentioning

confidence: 99%

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Therminator

Xie

Dousti

Pedram

2014

Proceedings of the 2014 International Symposium on Low Power Electronics and Design

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Maintaining safe chip and device skin temperatures in small form-factor mobile devices (such as smartphones and tablets) while continuing to add new functionalities and provide higher performance has emerged as a key challenge. This paper presents Therminator, an early stage, fast, full-device thermal analyzer, which generates accurate steady-state temperature maps of the entire smartphone starting from the Application Processor and other key device components, extending to the skin of the device itself. The thermal analysis is sensitive to detailed device specifications (including its material composition and 3-D layout) as well as different use cases (each case specifying the set of active device components and their activity levels). Therminator considers all major components within the device, builds a corresponding compact thermal model for each component and the whole device, and produces their steady-state temperature maps. Temperature results obtained by using Therminator have been validated against a commercial computational fluid dynamics-based tool, i.e., Autodesk Simulation CFD, and thermocouple measurements on a Qualcomm Mobile Developer Platform. A case study on a Samsung Galaxy S4 using Therminator is provided to relate the device performance to the skin temperature and investigate the thermal path design.

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Section: Related Workmentioning

confidence: 99%

Section: Related Workmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Therminator

Xie

Dousti

Pedram

2014

Proceedings of the 2014 International Symposium on Low Power Electronics and Design

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“…Several studies have focused on the cooling challenges of hand-held devices; Brown et al [2], Lee et al [5], Mongia et al [6], Huh et al [4], and Gurrum et al [3].…”

Section: Performance Expectationsmentioning

confidence: 99%

Thermal management challenges in the passive cooling of handheld devices

Wagner¹,

Maltz²

2013

19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)

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This study explores the limits of cooling for handheld devices based on both testing and simulation under various conditions and provides guidelines for maximizing the amount of power that can be dissipated in these small form-factor devices. The factors affecting the maximum possible power dissipation are the available surface area and surface finishes, selection of the outer shell materials, thermal interface materials, heat spreaders and air gaps. In most cases, the limiting factor in the thermal design of these devices is not the temperatures of the internal components but the temperature of the external surfaces since these are in direct contact with the skin of the user. There have been studies that address the maximum allowable comfortable touch temperature of a handheld device. This study presents methods for maximizing the internal power dissipation of these devices while limiting the touch temperatures to the maximum comfortable limits.

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