Growth of electrolytic copper dendrites. II: Oxalic acid medium

Devos, O.; Gabrielli, C.; Beitone, Lionel; Mace, Charles R.; Ostermann, E.; Perrot, Hubert

doi:10.1016/j.jelechem.2007.05.003

Cited by 25 publications

(16 citation statements)

References 15 publications

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“…49,155,156 According to the ECM mechanisms of Sn and Sn solder alloys and the previous studies regarding the ECM and its inhibition of other materials, 15,[152][153][154][155][156][157][158][159][160][161] the possible strategies to inhibit the ECM of Sn and Sn solder alloys are summarized, including adding alloy elements, inhibitor, and pulsed or AC voltage.…”

Section: Inhibition Of Ecm Of Sn and Sn Solder Alloysmentioning

confidence: 99%

Electrochemical migration of Sn and Sn solder alloys: a review

et al. 2017

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Sn and Sn solder alloys in microelectronics are the most susceptible to suffer from electrochemical migration (ECM) which significantly compromises the reliability of electronics. This topic has attracted more and more attention from researchers since the miniaturization of electronics and the explosive increase in their usage have largely increased the risk of ECM. This article first presents an introductory overview of the ECM basic processes including electrolyte layer formation, dissolution of metal, ion transport and deposition of metal ions. Then, the article provides the major development in the field of ECM of Sn and Sn solder alloys in recent decades, including the recent advances and discoveries, current debates and significant gaps. The reactions at the anode and cathode, the mechanisms of precipitates formation and dendrites growth are summarized. The influencing factors including alloy elements (Pb, Ag, Cu, Zn, etc.), contaminants (chlorides, sulfates, flux residues, etc.) and electric field (bias voltage and spacing) on the ECM of Sn and Sn alloys are highlighted. In addition, the possible strategies such as alloy elements, inhibitor and pulsed or AC voltage for the inhibition of the ECM of Sn and Sn solder alloys have also been reviewed.

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Section: Inhibition Of Ecm Of Sn and Sn Solder Alloysmentioning

confidence: 99%

Electrochemical migration of Sn and Sn solder alloys: a review

et al. 2017

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“…On the other hand, ECM researches in thin electrolyte layers (TEL) are also extremely important, hence ECM susceptibility depends on the water layer thickness as well [16]. Furthermore, the concentrations of the used wet environment have a wide spectrum as well: high purity water [6], acidic or alkaline electrolytes [8,17] and also salts [18]. The most common contaminant type of salts is the NaCl, that can have an extremely impact on the ECC failure processes and thus, the ECM susceptibility of tin and tin-based solder alloys as well.…”

Section: Introductionmentioning

confidence: 99%

Electrochemical migration investigations on Sn-Sb solder alloys using 3.5 wt% NaCl solution

Medgyes

Kiss

Szurdan

et al. 2017

2017 40th International Spring Seminar on Electronics Technology (ISSE)

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“…On the other hand, migration tests in thin electrolyte layers (TEL) is also important, since ECM ability depends on the thickness of water layer as well [14]. Furthermore, the concentrations of the used electrolytes had a wide range as well: deionized water [5], acidic or alkaline electrolytes [15] and also salt electrolytes [16], which usually simulate the possible contamination effects. One of the most common contaminant is the Cl, which can strongly modify the electrochemical corrosion mechanism and therefore, the migration ability of tin and silver as well.…”

Section: Introductionmentioning

confidence: 99%

Electrochemical migration of Sn and Ag in NaCl environment

Medgyes

Szivos

Adam

et al. 2016

2016 IEEE 22nd International Symposium for Design and Technology in Electronic Packaging (SIITME)

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Abstract-The impact of chloride ion concentration on electrochemical migration (ECM) of tin and silver was studied by using an in-situ optical and electrical inspection system. It was found, that in both cases, dendrites grow not only in an electrolyte solution at low chloride concentration but also in an electrolyte at medium and high or even saturated chloride concentrations as well. According to the results, the migration susceptibility has decreased at low and medium concentration levels in both cases. However, the ECM susceptibility of Ag has increased, while the migration susceptibility of Sn was decreased at the saturated concentrations.

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Growth of electrolytic copper dendrites. II: Oxalic acid medium

Cited by 25 publications

References 15 publications

Electrochemical migration of Sn and Sn solder alloys: a review

Electrochemical migration of Sn and Sn solder alloys: a review

Electrochemical migration investigations on Sn-Sb solder alloys using 3.5 wt% NaCl solution

Electrochemical migration of Sn and Ag in NaCl environment

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