2010
DOI: 10.1016/j.jcrysgro.2010.08.004
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Growth of high quality a-plane GaN epi-layer on r-plane sapphire substrates with optimization of multi-buffer layer

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Cited by 14 publications
(12 citation statements)
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“…This intermediate layer was expected to reduce the density of threading dislocations, and the growth temperature of the third buffer layer increased to 1160 1C. These optimized growth conditions were verified in our previous report [11]. For the second sample (sample II), in-situ SiN x interlayer was additionally inserted in between the second and the third buffer layers of the modified two-step growth layers.…”
Section: Methodssupporting
confidence: 67%
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“…This intermediate layer was expected to reduce the density of threading dislocations, and the growth temperature of the third buffer layer increased to 1160 1C. These optimized growth conditions were verified in our previous report [11]. For the second sample (sample II), in-situ SiN x interlayer was additionally inserted in between the second and the third buffer layers of the modified two-step growth layers.…”
Section: Methodssupporting
confidence: 67%
“…1(a) shows the crosssectional and plan-view (inset) TEM images of sample I with two-beam conditions. For the cross-sectional TEM image viewed along the c-direction of sample I, partial dislocations (b ¼ 1/5o20-234) and several types of threading dislocations could be observed with the two beam condition of g ¼ [11][12][13][14][15][16][17][18][19][20]. Threading dislocations were formed at the interface between the substrate and the GaN layer, and it was shown that the majority of the defect lines starts to change direction from (1-100) to (11)(12)(13)(14)(15)(16)(17)(18)(19)(20) by the layer transition between three and two dimensional growth layers.…”
Section: Resultsmentioning
confidence: 99%
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