Crystalline silicon solar cells with copper-plated contacts are fabricated, encapsulated in ethylene-vinyl acetate (EVA), and subject to extended damp heat stress (85 C and 85% relative humidity). We source cell precursors from several different cell manufacturers and employ several different patterning methods of the silicon nitride layer and deposit a plated front contact stack of nickel, copper, and tin using light-induced plating. Across different Cu-plated samples, we find similar degradation that impacts