IEEE Design & Test of ComputersTHE TECHNOLOGICAL EVOLUTION of the IC fabrication process, consisting of device shrinking, power supply reduction, and increasing operating speeds, has significantly reduced the manufacturing yield and reliability of very deep-submicron (VDSM) ICs when various noise sources are present, as recent roadmaps (the International Technology Roadmap for Semiconductors, Medea, and IEEE Design & Test) have demonstrated. As a result, more and more applications must be robust in the presence of multiple faults. Consequently, fault tolerance in storage devices such as high-density and highspeed memories operating at low voltage, is a main concern nowadays and thus the focus of this work.Faults can occur during the fabrication process, with direct consequences in terms of yield and memory operation. Using VDSM technologies increases the chances of manufacturing defects. It is important to design fault-tolerant mechanisms to ensure that a memory operates correctly, even in the presence of defects such as open and short gates and connections that can result in stuck-at faults or coupling faults in memory cells.