High coupling efficiency, passive alignment setup for visible-range fiber-to-waveguide edge coupling

Lin, Nathan C.; Hassan, Sazzad; Zhao, Xuan; Veeraraghavan, Ashok; Robinson, Jacob T.

doi:10.1117/1.jnp.14.046018

Cited by 6 publications

(1 citation statement)

References 26 publications

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“…Various optical approaches have been reported in this research field, such as the use of modified silica substrates, surfaces, waveguides, optical resonators and other setups, which contribute to the design of functional devices. 23 In this context it could be noted for example how the control of nanochemistry has allowed to modify light scattering properties. The capability to organize hybrid silica NPs towards hybrid silica nanoarrays could lead to modified surfaces and substrates for improved light scattering resonances and increased signaling from the surface, across and through the materials by means of different approaches such as photonics surfaces, materials and waveguide substrates respectively.…”

Section: Introductionmentioning

confidence: 99%

Development of nano- and microdevices for the next generation of biotechnology, wearables and miniaturized instrumentation

Palacios

Bracamonte

2022

RSC Adv.

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Section: Introductionmentioning

confidence: 99%

Development of nano- and microdevices for the next generation of biotechnology, wearables and miniaturized instrumentation

Palacios

Bracamonte

2022

RSC Adv.

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Silicon Nitride Integrated Photonics from Visible to Mid‐Infrared Spectra

Buzaverov,

Baburin,

Sergeev

et al. 2024

Laser & Photonics Reviews

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Silicon nitride (Si3N4) photonic integrated circuits (PICs) are of great interest due to their extremely low propagation loss and higher integration capabilities. The number of applications based on the silicon nitride integrated photonics platform continues to grow, including the Internet of Things (IoT), artificial intelligence (AI), light detection and ranging (LiDAR), hybrid neuromorphic and quantum computing. It's potential for CMOS compatibility, as well as advances in heterogeneous integration with silicon‐on‐insulator, indium phosphate, and lithium niobate on insulator platforms, are leading to an advanced hybrid large‐scale PICs. Here, they review key trends in Si3N4 photonic integrated circuit technology and fill an information gap in the field of state‐of‐the‐art devices operating from the visible to the mid‐infrared spectrum. A comprehensive overview of its microfabrication process details (deposition, lithography, etching, etc.) is introduced. Finally, the limitations and challenges of silicon nitride photonics performance are pointed out in an ultra‐wideband, providing routes and prospects for its future scaling and optimization.

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3D trapezoidal edge coupler with high efficiency and tolerance based on Silicon-on-Insulator

Chen

et al. 2023

Optical Materials

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High coupling efficiency, passive alignment setup for visible-range fiber-to-waveguide edge coupling

Cited by 6 publications

References 26 publications

Development of nano- and microdevices for the next generation of biotechnology, wearables and miniaturized instrumentation

Development of nano- and microdevices for the next generation of biotechnology, wearables and miniaturized instrumentation

Silicon Nitride Integrated Photonics from Visible to Mid‐Infrared Spectra

3D trapezoidal edge coupler with high efficiency and tolerance based on Silicon-on-Insulator

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