2015
DOI: 10.1109/tvlsi.2014.2332277
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High-Frequency CMOS Active Inductor: Design Methodology and Noise Analysis

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Cited by 15 publications
(7 citation statements)
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“…To validate the performance of proposed AGI, we have done the noise analysis. An in‐noise and out‐noise 40 have been evaluated for the proposed inductor as given in Figures 15 and 16.…”
Section: Realization Of Agi Using the Proposed Cciismentioning
confidence: 99%
“…To validate the performance of proposed AGI, we have done the noise analysis. An in‐noise and out‐noise 40 have been evaluated for the proposed inductor as given in Figures 15 and 16.…”
Section: Realization Of Agi Using the Proposed Cciismentioning
confidence: 99%
“…A detailed design methodology and noise analysis is reported in Zito et al . []. The results of the noise analysis, simulations, and measurements prove that the input noise of the proposed AI is very low compared to any other topologies, and it is mainly due to the thermal noise of the parasitic resistance of the primary spiral of the integrated transformer [ Zito et al ., ].…”
Section: Mm‐wave Active Inductormentioning
confidence: 99%
“…For this reason, one of the most severe challenges in the radio‐frequency integrated circuits is the realization of on‐chip high quality factor (Q) LC filters. Active inductors (AIs) have the potential to provide a solution [ Zito et al ., ].…”
Section: Introductionmentioning
confidence: 99%
“…Large inductances are often B Longjie Zhong zhong.longjie@163.com 1 Institute of Electronic CAD, Xidian University, Xi'an, China 2 School of Science and Engineering, Teesside University, Middlesbrough TS1 3BA, UK needed if operational frequency of a circuit is not very high, but they are difficult to be integrated into an integrated circuit (IC) due to the large chip area required. There have been a number of attempts to develop inductor simulators, which can perform the analog function of inductance [1][2][3][4][5][6][7][8][9][10][11][12]. The most commonly used structures of these inductor simulators are composed of multiple passive components and complicated operational modules such as current conveyor (CC) [2][3][4][5], current feedback operational amplifier (CFOA) [6], operational trans-conductance amplifier (OTA) [7], current backward trans-conductance amplifier (CBTA) [8] and current differencing buffered amplifier (CDBA) [9].…”
Section: Introductionmentioning
confidence: 99%
“…This is because that they attempt to achieve functional flexibility, i.e., to be reconfigured to form other circuit functions such as frequency dependent negative resistor (FDNR), while aiming at low-frequency applications. Other structures [10][11][12] use fewer and less complicated components to be structurally simple and to minimize the effect of parasitic parameters. However, these are primarily used for high-frequency or RF applications.…”
Section: Introductionmentioning
confidence: 99%