“…Consequently, the degradation rate is accelerated [15,20]. To reduce the possibility of electrons being trapped at the oxide-silicon interface, the current lines must be moved away and the electric field must be decreased in this zone in order to improve the device reliability, by changing the fabrication process and the device structure or layout [11,21,22]. HTSL seems to be slower than other ageing tests with these conditions (75°C-700 h).…”