High-performance ultra-small single crystalline silicon microphone of an integrated structure

Tajima, Tsuyoshi; Nishiguchi, Taro; Chiba, Shin-ichi; Morita, and Hideki; Abe, Masaki; Tanioka, Kenkichi; Saito, Naoko; Esashi, Masayoshi

doi:10.1016/s0167-9317(03)00108-4

Cited by 34 publications

(19 citation statements)

References 5 publications

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“…MEMS devices are found, for instance, in a variety of hand-held electronic devices, often as accelerometers [1], microphones [2] or pressure sensors [3]. Recently, MEMS have been proposed for energy harvesting applications [4], ultra-high resolution mass sensors [5] and as a suitable candidate for the development of biological sensors in lab-ona-chip technologies [6].…”

Section: Introductionmentioning

confidence: 99%

Strong opto-electro-mechanical coupling in a silicon photonic crystal cavity

Pitanti¹,

Fink²,

Safavi-Naeini³

et al. 2015

Opt. Express

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Abstract:We fabricate and characterize a microscale silicon opto-electromechanical system whose mechanical motion is coupled capacitively to an electrical circuit and optically via radiation pressure to a photonic crystal cavity. To achieve large electromechanical interaction strength, we implement an inverse shadow mask fabrication scheme which obtains capacitor gaps as small as 30 nm while maintaining a silicon surface quality necessary for minimizing optical loss. Using the sensitive optical read-out of the photonic crystal cavity, we characterize the linear and nonlinear capacitive coupling to the fundamental ω m /2π = 63 MHz in-plane flexural motion of the structure, showing that the large electromechanical coupling in such devices may be suitable for realizing efficient microwave-to-optical signal conversion. References and links 1. N. Yazdi, F. Avazi, and K. Najafi, "Micromachined inertial sensors," Proc. IEEE 86, 1640IEEE 86, -1659IEEE 86, (1998. 2. T. Tajima, T. Nishiguchi, S. Chiba, A. Morita, M. Abe, K. Tanioka, N. Saito, and M. Esashi, "High-performance ultra-small single crystalline silicon microphone of an integrated structure," Microelectron. Eng. 67-68, 508-519 (2003).

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Section: Introductionmentioning

confidence: 99%

Strong opto-electro-mechanical coupling in a silicon photonic crystal cavity

Pitanti¹,

Fink²,

Safavi-Naeini³

et al. 2015

Opt. Express

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“…Various single chip and double chip processes have been reported to enhance microphone frequency response [18][19][20][21][22]. In single chip processes, thick epitaxial growth or siliconon-insulator is required to fabricate rigid backplate, but which increases process complexity.…”

Section: Design Considerationsmentioning

confidence: 99%

Double-chip condenser microphone for rigid backplate using DRIE and wafer bonding technology

Kwon

Lee

2007

Sensors and Actuators A: Physical

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“…We can see that each sidewall consists of two (111) planes. Microphone backchambers are often fabricated by etching of the silicon substrate with alkali solutions [6] or deep reactive ion etching (DRIE) [7]. Figure 6 shows cross-sections of our microphone and the other two microphone types, fabricated using the same size chip.…”

Section: Backchamber Designmentioning

confidence: 99%

“…In particular, condensertype silicon microphones show good characteristics and low power consumption [3][4][5][6][7]. However, current demands require much smaller microphones.…”

Section: Introductionmentioning

confidence: 99%

Small Silicon Condenser Microphone Improved with a Backchamber with Concave Lateral Sides

Kasai

Tsurukame

Takahashi

et al. 2007

TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference

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We have developed a very small, high-sensitivity silicon condenser microphone, in which a backchamber with concave lateral sides and a specific diaphragm were used as improvements. The concave sides increase the volume of the backchamber and thus solve the trade-off between chip downsizing and sensitivity. The novel backchamber was fabricated using a combination of isotropic and anisotropic etching. The diaphragm is supported only at the four corners to yield good deformation. The chip is 1.2 mm×1.3 mm×0.4 mm. The sensitivity is -41 dBV (8.8 mV/Pa) at 1 kHz and the frequency response is flat between 100 Hz and 10 kHz.

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High-performance ultra-small single crystalline silicon microphone of an integrated structure

Cited by 34 publications

References 5 publications

Strong opto-electro-mechanical coupling in a silicon photonic crystal cavity

Strong opto-electro-mechanical coupling in a silicon photonic crystal cavity

Double-chip condenser microphone for rigid backplate using DRIE and wafer bonding technology

Small Silicon Condenser Microphone Improved with a Backchamber with Concave Lateral Sides

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