1977
DOI: 10.1016/0038-1101(77)90135-6
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High temperature annealing behaviour of Schottky barriers on GaAs with gold and gold-gallium contacts

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Cited by 44 publications
(7 citation statements)
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“…The typical I – V curves are then shown in Figure b, where a diode like I – V curve with an onsite voltage of ∼1 V is clearly shown. This Schottky barrier is mainly attributed to the atomically connected Ga/GaAs interface without any trap states and hence without any significant Fermi level pinning there, which is similar to the electrical contact characteristics of between Au–Ga alloy and GaAs NW reported in the past . On one hand, Ni has a relatively similar work function to the GaAs (5.1–5.3 eV, p-type as verified in Figure S3), and ohmic contact is therefore resulted therein. , This was further verified by the I – V characteristics of the thermally deposited Ni electrodes on the GaAs NW without Ga segment, as typically shown in Figure S4.…”
Section: Resultssupporting
confidence: 83%
“…The typical I – V curves are then shown in Figure b, where a diode like I – V curve with an onsite voltage of ∼1 V is clearly shown. This Schottky barrier is mainly attributed to the atomically connected Ga/GaAs interface without any trap states and hence without any significant Fermi level pinning there, which is similar to the electrical contact characteristics of between Au–Ga alloy and GaAs NW reported in the past . On one hand, Ni has a relatively similar work function to the GaAs (5.1–5.3 eV, p-type as verified in Figure S3), and ohmic contact is therefore resulted therein. , This was further verified by the I – V characteristics of the thermally deposited Ni electrodes on the GaAs NW without Ga segment, as typically shown in Figure S4.…”
Section: Resultssupporting
confidence: 83%
“…4a. Such Ga diffusion is consistent with the results of the Au-GaAs contact system [6]. The black spots increased as the alloying temperature increased, which indicated that Ga out-diffusion was dependent on the alloying temperature.…”
Section: Fabrication Of N-lnogaosb/p-io~ Alosh/p-gash and N-supporting
confidence: 89%
“…The exact alloying mechanism that causes the degradation of the SDs was not very clear. This will result in significant field emissions along the barrier and increase the flow through it [48]. This behavior also observed in studies on AlGaN or GaN substrates [29].…”
Section: Figurementioning
confidence: 55%
“…The expected barrier height values could not be observed due to alloying behavior. This behavior causes the AuGa compounds to change the interface chemistry of the Au-GaAs interface as a result of some Ga out-diffusion and solid-state reactions with Au, and the remaining As atoms make the semiconductor highly doped [35,37,48]. The exact alloying mechanism that causes the degradation of the SDs was not very clear.…”
Section: Figurementioning
confidence: 99%