2018
DOI: 10.4028/www.scientific.net/msf.924.120
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Hot Filament CVD Growth of 4H-SiC Epitaxial Layers

Abstract: Hot filament CVD (HFCVD) growth of undoped 4H-SiC epitaxial layers on 100 mm n-type 4o-off 4H-SiC substrates is presented as an alternate growth method for the first time. High quality crystalline material with a low density of polytype inclusions has been demonstrated and characterized with optical micrographs, SEM imaging, micro-Raman measurements, and high resolution XRD. Typical growth rates are ~3 μm/hour. Double rocking omega scans revealed diffraction peaks with a FWHM of 23 arcsec.

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Cited by 4 publications
(2 citation statements)
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“…Another unique characteristic of the technique is the ability to perform localized or selective deposition on patterned substrates. 97 One of the processes involved in CVD is MOCVD, otherwise known as metal organic chemical vapor deposition. It is the main instrument used for production of LED.…”
Section: Common Deposition Methods Of Gate Oxide Filmsmentioning
confidence: 99%
“…Another unique characteristic of the technique is the ability to perform localized or selective deposition on patterned substrates. 97 One of the processes involved in CVD is MOCVD, otherwise known as metal organic chemical vapor deposition. It is the main instrument used for production of LED.…”
Section: Common Deposition Methods Of Gate Oxide Filmsmentioning
confidence: 99%
“…Although continuous improvement has been made in SiC epitaxial growth, such as the high uniformity in doping concentration and remarkable reduction of epi-defects (trianglar 3C inclusion and carrot defect) [7,8], the density of extended defects in SiC epi-wafer is still on the order of 10 2 -10 4 cm −2 . The size and performance of SiC devices, especially for high-voltage bipolar devices, are still severely hindered by the extended defects, surface defects, and interfacial dislocations of SiC substrate and its epitaxial layers.…”
Section: Introductionmentioning
confidence: 99%