Hybrid Nanocomposite Thermal Interface Materials: The Thermal Conductivity and the Packing Density

Zhang, Tingting; Sammakia, Bahgat; Yang, Zhihao; Wang, Howard

doi:10.1115/1.4040204

Cited by 10 publications

(3 citation statements)

References 42 publications

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“…For spherical fillers, mixing of multi-scale particles are the simplest and favorite method to further increase the thermal conductivity of TIMs. 39,40 Particle packing theory, which firstly proposed by Andreasen 41 in 1929 and modified by Dinger and Funk, 42 has been widely applied to increase the comprehensive properties of ceramics, concrete and other materials. Lin Mao et al 43 first used the particle packing theory to solve particle diameter matching problems of multiscale particle in TIMs.…”

Section: Resultsmentioning

confidence: 99%

Multi-scale hybrid spherical graphite composites: a light weight thermal interface material with high thermal conductivity and simple processing technology

Yan

Kong

et al. 2022

RSC Adv.

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Section: Resultsmentioning

confidence: 99%

Multi-scale hybrid spherical graphite composites: a light weight thermal interface material with high thermal conductivity and simple processing technology

Yan

Kong

et al. 2022

RSC Adv.

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“…TIM research has focused on three primary areas of using high-performance fillers, studying the micro and nanoscale TIM, and developing carbon-allotropes-based TIM to enhance performance [40,41,42]. Carbon nanotube fillers are the most promising of all the carbon allotropes, and have become front research topics in TIM which can decrease thermal stress caused by CTE mismatch and can keep chemicals table over a wide range of temperatures.…”

Section: High-temperature Componentsmentioning

confidence: 99%

Silicon Carbide Converters and MEMS Devices for High-temperature Power Electronics: A Critical Review

Guo

Xun

et al. 2019

Micromachines

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The significant advance of power electronics in today’s market is calling for high-performance power conversion systems and MEMS devices that can operate reliably in harsh environments, such as high working temperature. Silicon-carbide (SiC) power electronic devices are featured by the high junction temperature, low power losses, and excellent thermal stability, and thus are attractive to converters and MEMS devices applied in a high-temperature environment. This paper conducts an overview of high-temperature power electronics, with a focus on high-temperature converters and MEMS devices. The critical components, namely SiC power devices and modules, gate drives, and passive components, are introduced and comparatively analyzed regarding composition material, physical structure, and packaging technology. Then, the research and development directions of SiC-based high-temperature converters in the fields of motor drives, rectifier units, DC–DC converters are discussed, as well as MEMS devices. Finally, the existing technical challenges facing high-temperature power electronics are identified, including gate drives, current measurement, parameters matching between each component, and packaging technology.

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“…However, there are limitations on the applicable temperature range due to the low melting point of the polymer . Accordingly, sintered pastes using nanoparticles (iv) have been actively investigated for use in power electronic devices. − In these applications, Pb-free solder (ii) such as Sn–Ag or Sn–Cu (melting point of around 220 °C), which is widely used in die-bonded parts, could not be used. This is because SiC semiconductors in power modules operate at temperatures higher (>200 °C) than those of conventionally applied Si semiconductors .…”

Section: Introductionmentioning

confidence: 99%

Ag Nanoparticle-Based Aerogel-like Films for Interfacial Thermal Management

Munakata

Kobayashi

Sugime

et al. 2022

ACS Appl. Nano Mater.

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A Ag aerogel-like film (referred to as aerogel hereafter), used as a thermal interface material with enhanced performance and thermal stability, is reported. An aerogel/ foil/aerogel "monocomposite" is created by rapidly forming and depositing Ag nanoparticles on both faces of a Ag foil by the gas-evaporation and particle-deposition method in a few minutes. The monocomposite, having an aerogel of a low packing ratio (<10%) with a clean surface, exhibits low thermal resistance (18 mm 2 K W −1 ) when sandwiched with Cu rods. The monocomposite exhibits excellent thermal stability and significantly reduced thermal resistance (3.0 mm 2 K W −1 ) at 246 °C, keeping its low thermal resistance (2.8 mm 2 K W −1 ) after the temperature is decreased to 51 °C; further, the resistance reduces to 2.1 mm 2 K W −1 after 10 cycles of heating and cooling (100−200 °C). The Ag monocomposite, having high performance comparable to that of the benchmark In sheet and excellent thermal stability at a temperature higher than the melting point of In, will enable high-power and high-temperature operation of computing and power devices.

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Hybrid Nanocomposite Thermal Interface Materials: The Thermal Conductivity and the Packing Density

Cited by 10 publications

References 42 publications

Multi-scale hybrid spherical graphite composites: a light weight thermal interface material with high thermal conductivity and simple processing technology

Multi-scale hybrid spherical graphite composites: a light weight thermal interface material with high thermal conductivity and simple processing technology

Silicon Carbide Converters and MEMS Devices for High-temperature Power Electronics: A Critical Review

Ag Nanoparticle-Based Aerogel-like Films for Interfacial Thermal Management

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