Hybrid Solid State/Fluidic Cooling for Hot Spot Removal

Sahu, Vivek; Joshi, Yogendra; Fedorov, Andrei G.

doi:10.1080/15567260903058033

Cited by 22 publications

(8 citation statements)

References 11 publications

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“…Through modeling, device fabrication, and testing of the above Hybrid Cooling Scheme, it was found that the optimum current of the SLC is a function of the superlattice size, ambient temperature, ground electrode location, as well as the thermal and interface resistance [14]. The optimum current increases with the superlattice size and ambient temperature.…”

Section: Hybrid Cooling Schemementioning

confidence: 99%

“…The electrical current can spread to the substrate as heat flow spreads. The model that Sahu et al reported [14] could be used in this model, however, we leave this factor as a perfect electrode (zero resistance) to avoid the complexity. Current density through the silicon substrate is much lower than through the SLC device.…”

Section: Spreading Joule Heating In Silicon Substratementioning

confidence: 99%

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Energy Efficient Solid-State Cooling for Hot Spot Removal

Yazawa

Fedorov

Joshi

et al. 2014

Encyclopedia of Thermal Packaging

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In this chapter, modeling and analysis of a hybrid scheme of a thermoelectric microcooler and a microchannel single-phase heat sink is discussed for a hotspot cooling. Following the introduction, the hybrid scheme concept is described. The Section 3 describes thermoelectric materials and fabrication of the solid-state microcoolers to give the necessary information for the thermal modeling, analysis, and the optimization of thermoelectric element in Section 4. Microchannel geometry and the pump power are discussed in Section 5 with an analytic model, and then the heat sink design itself is designed to optimum for lowest power used for the required cooling performance. Integrated cooling power for an integrated circuit (IC) with a hotspot as a function of heat flux is demonstrated. Section 6 summarizes the energy efficient cooling performance by the discussed hybrid scheme. To make technological challenges clear, concept of a new packaging approach for this integration is illustrated in Section 7 followed by the conclusions.

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Section: Hybrid Cooling Schemementioning

confidence: 99%

Section: Spreading Joule Heating In Silicon Substratementioning

confidence: 99%

Energy Efficient Solid-State Cooling for Hot Spot Removal

Yazawa

Fedorov

Joshi

et al. 2014

Encyclopedia of Thermal Packaging

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“…The main issue is the extreme temperature that results at the hot spots. It is known that next generation electronic chips are expected to produce around 500 W cm -2 as the background and over 1000 W cm -2 at the hot spots [1][2]. Special application microelectronics already need adequate efficient cooling for background heat fluxes as high as several kilowatts per square centimeter with hot spots having an order of magnitude higher heat fluxes.…”

Section: Introductionmentioning

confidence: 99%

Inverse Design of Cooling of Electronic Chips Subject to Specified Hot Spot Temperature and Coolant Inlet Temperature

Reddy

Dulikravich

2015

Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano

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Most methods for designing electronics cooling schemes do not offer the information on what levels of heat fluxes are maximally possible to achieve with the given material, boundary and operating conditions. Here, we offer an answer to this inverse problem posed by the question below. Given a micro pin-fin array cooling with these constraints: - given maximum allowable temperature of the material, - given inlet cooling fluid temperature, - given total pressure loss (pumping power affordable), and - given overall thickness of the entire electronic component, find out the maximum possible average heat flux on the hot surface and find the maximum possible heat flux at the hot spot under the condition that the entire amount of the inputted heat is completely removed by the cooling fluid. This problem was solved using multi-objective constrained optimization and metamodeling for an array of micro pin-fins with circular, airfoil and symmetric convex cross sections that is removing all the heat inputted via uniform background heat flux and by a hot spot. The goal of this effort was to identify a cooling pin-fin shape and scheme that is able to push the maximum allowable heat flux as high as possible without the maximum temperature exceeding the specified limit for the given material. Conjugate heat transfer analysis was performed on each of the randomly created candidate configurations. Response surfaces based on Radial Basis Functions were coupled with a genetic algorithm to arrive at a Pareto frontier of best trade-off solutions. The Pareto optimized configuration indicates the maximum physically possible heat fluxes for specified material and constraints.

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“…Hot spots and non-uniform temperature distribution in the chip can degrade the performance and reduce the reliability. Unfortunately, most of the existing cooling techniques can not remove the hot spots selectively and they have to operate in a sub-optimal fashion and over-cool the whole chip [7]. To overcome these difficulties, one solution is to use hybrid solid-state and liquid cooling.…”

Section: Introductionmentioning

confidence: 99%

“…According to ref [7] spot cooling inside a microchannel can be used for bubble condensation and the control of the two-phase flow. In this application, it is important to study the maximum cooling and cooling power density of the solid-state cooler as a function of the flow parameters, heat transfer coefficient and the liquid temperature.…”

Section: Introductionmentioning

confidence: 99%