Imidization-induced carbon nitride nanosheets orientation towards highly thermally conductive polyimide film with superior flexibility and electrical insulation

Wang, Yanyan; Zhang, Xian; Ding, Xin; Zhang, Ping; Shu, Mengting; Zhang, Qian; Gong, Yi; Zheng, Kang; Tian, Xingyou

doi:10.1016/j.compositesb.2020.108267

Cited by 70 publications

(54 citation statements)

References 54 publications

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“…as thermally conductive fillers to prepare thermally conductive PI-based composite films by solution blending followed by blade coating. Wang et al [16] prepared carbon nitride nanosheets/PI (CNNS/PI) thermally conductive composite films by "solution blendingblade coating" technology. When the amount of CNNS was 20 wt%, the corresponding in-plane λ (λ ∥ ) and throughplane λ (λ ⊥ ) of the CNNS/PI thermally conductive composite films reached 2.04 W/mK and 0.32 W/mK, respectively.…”

Section: Introductionmentioning

confidence: 99%

Significant Reduction of Interfacial Thermal Resistance and Phonon Scattering in Graphene/Polyimide Thermally Conductive Composite Films for Thermal Management

et al. 2021

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The developing flexible electronic equipment are greatly affected by the rapid accumulation of heat, which is urgent to be solved by thermally conductive polymer composite films. However, the interfacial thermal resistance (ITR) and the phonon scattering at the interfaces are the main bottlenecks limiting the rapid and efficient improvement of thermal conductivity coefficients (λ) of the polymer composite films. Moreover, few researches were focused on characterizing ITR and phonon scattering in thermally conductive polymer composite films. In this paper, graphene oxide (GO) was aminated (NH2-GO) and reduced (NH2-rGO), then NH2-rGO/polyimide (NH2-rGO/PI) thermally conductive composite films were fabricated. Raman spectroscopy was utilized to innovatively characterize phonon scattering and ITR at the interfaces in NH2-rGO/PI thermally conductive composite films, revealing the interfacial thermal conduction mechanism, proving that the amination optimized the interfaces between NH2-rGO and PI, reduced phonon scattering and ITR, and ultimately improved the interfacial thermal conduction. The in-plane λ (λ∥) and through-plane λ (λ⊥) of 15 wt% NH2-rGO/PI thermally conductive composite films at room temperature were, respectively, 7.13 W/mK and 0.74 W/mK, 8.2 times λ∥ (0.87 W/mK) and 3.5 times λ⊥ (0.21 W/mK) of pure PI film, also significantly higher than λ∥ (5.50 W/mK) and λ⊥ (0.62 W/mK) of 15 wt% rGO/PI thermally conductive composite films. Calculation based on the effective medium theory model proved that ITR was reduced via the amination of rGO. Infrared thermal imaging and finite element simulation showed that NH2-rGO/PI thermally conductive composite films obtained excellent heat dissipation and efficient thermal management capabilities on the light-emitting diodes bulbs, 5G high-power chips, and other electronic equipment, which are easy to generate heat severely.

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Section: Introductionmentioning

confidence: 99%

Significant Reduction of Interfacial Thermal Resistance and Phonon Scattering in Graphene/Polyimide Thermally Conductive Composite Films for Thermal Management

et al. 2021

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“…The diffraction peak around 21.4°is observed in MXene/PI film, which corresponds to the amorphous structure of PI film [38]. Compared to the MXene, the (002) peak of MXene/PI film shifts from 6.32° to 6.7°, corresponding to the reduced interlayer spacing from 1.4 to 1.32 nm [34].…”

Section: Structural Characterizations Of Mxene Pi Paa and Mxene/pi Filmmentioning

confidence: 99%

“…To The development of multifunction and miniaturization in modern electronics generates increasingly serious heat accumulation, which affects the efficiency and reliability [22,38]. Therefore, efficient heat management is important for dissipating excessive heat.…”

Section: Mechanical Properties Of Mxene/pi Filmsmentioning

confidence: 99%

“…S2) also demonstrate the protection effect of TiO 2 during burning. There may be two reasons for these results [22,38]: On the one hand, compared with PI film, MXene/PI film exhibits excellent thermal conductivity leading to rapid heat diffusion. On the other hand, the formation of TiO 2 can organize a physical protective layer on the MXene-PI interface, which wraps the residue formed after PI carbonization, effectively preventing the combustion of the underlying materials and the propagation of flame.…”

Section: Flame Resistance Of Mxene/pi Filmsmentioning

confidence: 99%

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Flame-retardant MXene/polyimide film with outstanding thermal and mechanical properties based on the secondary orientation strategy

et al. 2021

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“…[3][4][5] However, general polymers usually have a low thermal conductivity (TC, <0.5 W m -1 K -1 ). 6 TC of polymers has been improved effectively by adding high heat fillers such as ceramics, [7][8][9] metals, 10 carbon fillers 11,12 and metallic oxides. 13,14 The interface is the key issue to control TC of the polymer composites because phonon scattering usually occurs at the filler/filler or filler/polymer interfaces, which further leads to interfacial thermal resistance (ITR).…”

Section: Introductionmentioning

confidence: 99%

High thermal conductivity thermoplastic polyurethane/boron nitride/liquid metal composites: the role of the liquid bridge at the filler/filler interface

Liu

Ouyang

et al. 2021

Mater. Adv.

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Imidization-induced carbon nitride nanosheets orientation towards highly thermally conductive polyimide film with superior flexibility and electrical insulation

Cited by 70 publications

References 54 publications

Significant Reduction of Interfacial Thermal Resistance and Phonon Scattering in Graphene/Polyimide Thermally Conductive Composite Films for Thermal Management

Significant Reduction of Interfacial Thermal Resistance and Phonon Scattering in Graphene/Polyimide Thermally Conductive Composite Films for Thermal Management

Flame-retardant MXene/polyimide film with outstanding thermal and mechanical properties based on the secondary orientation strategy

High thermal conductivity thermoplastic polyurethane/boron nitride/liquid metal composites: the role of the liquid bridge at the filler/filler interface

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