The flexible nonvolatile memory thin-film transistor (F-MTFT) is demonstrated. The gate stack is composed of ferroelectric poly(vinylidene fluoride-trifluoroethylene) gate insulator and ZnO semiconducting channel. All the processes are performed below 150 C on a poly(ethylene naphthalate) substrate. The ferroelectric field-effect-driven memory window and the on/off ratio of the fabricated F-MTFT were 7.8 V and 10 8 , respectively. These behaviors did not show so marked degradations at bending situations with a curvature radius of 0.97 cm and after repetitive bendings of 20,000 cycles. The programmed on/off ratio was initially 6.6 Â 10 5 and retained to be approximately 130 after a lapse of 15,000 s.Flexible electronic devices and systems realized on bendable and rollable substrates define important application fields of new paradigm for next-generation "consumer electronics." 1-6 In developing the highly-functional flexible electronic systems, an embeddable nonvolatile memory device is a strongly required as a core element for saving the power consumption 7 as well as for storing the information.So far, various approaches using different operating origins and material combinations such as oxide-based 8 and polymer-based 9 resistive-type memory devices, have been tried to realize the nonvolatile memory functions on the flexible substrates. Among them, the ferroelectric-field-effect-based thin-film transistor (TFT) is one of the most promising candidates for the flexible memory devices. 10,11 The ferroelectric TFT can be operated in a very reproducible way with a definitely designable operation principle and simply be fabricated. The employment of polymeric ferroelectric thin film can offer an attractive solution to reduce the process temperature. A poly(vinylidene fluoride-trifluoroethylene) [P(VDF-TrFE)] is the most typical ferroelectric copolymer material. It shows superior properties of a relatively large remnant polarization, a short switching time, and a good thermal stability, compared with other organic ferroelectric materials. 12,13 The P(VDF-TrFE) thin film can simply be formed by a solution-based spin-coating method and be crystallized at a lower temperature around 140 C, which is one of the benefits in realizing the memory device on the plastic substrate. Although most works on the fabrication and characterization for the nonvolatile memory transistors using the P(VDF-TrFE) have mainly been investigated for realizing all-organic memory transistors with organic semiconducting channel layers, 14,15 the weaknesses of a low field-effect mobility, an unsatisfactory ambient stability, and a difficult device integration with organic-based transistors seriously limit the scopes of application fields. A powerful alternative for enhancing and stabilizing the device performance is to utilize the oxide semiconductors such as ZnO or In-Ga-Zn oxide (IGZO). The oxide semiconductorbased TFTs present such beneficial features as high field-effect mobility, excellent uniformity, and robust device stability. 16,17 The comb...