Improvements in MEMS gyroscope production as a result of using in situ, aligned, current-limited anodic bonding

Rogers, Tony; Aitken, Nick; Stribley, Kevin; Boyd, James G.

doi:10.1016/j.sna.2005.03.009

Cited by 33 publications

(24 citation statements)

References 3 publications

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“…Thus, for example, in a commercial anodic bonding system, a typical range of bonding conditions for joining 101?6 mm diameter Pyrex glass wafers to silicon might be a bond temperature of 350-450uC, a voltage of 50021000 V, a bonding time of 6 min and an overall cycle time of 20 min. 33,34 Typical tensile strengths of anodic bonds are 10215 MPa. 35,36 Detail of a silicon-Pyrex anodic bond is shown in Fig.…”

Section: Anodic Bondingmentioning

confidence: 99%

Joining of engineering ceramics

Fernie

Drew

Knowles

2009

International Materials Reviews

250

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Engineering ceramics such as alumina, zirconia, silicon nitride and silicon carbide can now be manufactured reliably with reproducible properties. As such, they are of increasing interest to industry, particularly for use in demanding environments, where their thermomechanical performance is of critical importance, with applications ranging from fuel cells to cutting tools. One aspect common to virtually all applications of engineering ceramics is that eventually they must be joined with another material, most usually a metal. The joining of engineering ceramics to metals is not always easy. There are two main considerations. The first consideration is the basic difference in atomic bonding: the ionic or covalent bonding of the ceramic, compared to the metallic bond. The second consideration is the mismatch in the coefficient of thermal expansion. In general, ceramics have a lower coefficient of thermal expansion than metals and, if high tensile forces are produced in the ceramic, either as a consequence of operating conditions or from the joining procedure itself, failure can occur. The plethora of joining processes available will be reviewed in this article, placing them in context from both an academic and commercial perspective. Comment will be made on research reporting advances on known technology, as well as introducing 'newer' technologies developed over the last 10 years. Finally, reviews and commentary will be made on the potential applications of the various joining processes in the commercial environment.

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Section: Anodic Bondingmentioning

confidence: 99%

Joining of engineering ceramics

Fernie

Drew

Knowles

2009

International Materials Reviews

250

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“…Anodic wafer bonding [50] is a widely used method in industrial packaging and manufacturing, especially in the field of sensor systems [51,52]. With its high bonding strength and robustness [53], it provides a suitable technique to connect individual wafers to form a 3D ion trap.…”

Section: Wafer Bond Dicing and Assemblymentioning

confidence: 99%

Industrially Microfabricated Ion Trap with 1 eV Trap Depth

Auchter¹,

Axline²,

Decaroli³

et al. 2022

Preprint

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Scaling trapped-ion quantum computing will require robust trapping of at least hundreds of ions over long periods, while increasing the complexity and functionality of the trap itself. Symmetric three-dimensional (3D) structures enable high trap depth, but microfabrication techniques are generally better suited to planar structures that produce less ideal conditions for trapping. We present an ion trap fabricated on stacked 8-inch wafers in a large-scale MEMS microfabrication process that provides reproducible traps at a large volume. Electrodes are patterned on the surfaces of two opposing wafers bonded to a spacer, forming a 3D structure with 2.5 µm standard deviation in alignment across the stack. We implement a design achieving a trap depth of 1 eV for a 40 Ca + ion held at 200 µm from either electrode plane. We characterize traps, achieving measurement agreement with simulations to within ±5% for mode frequencies spanning 0.6-3.8 MHz, and evaluate stray electric field across multiple trapping sites. We measure motional heating rates over an extensive range of trap frequencies, and temperatures, observing 40 phonons/s at 1 MHz and 185 K. This fabrication method provides a highly scalable approach for producing a new generation of 3D ion traps.

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“…The mechanical vibratory gyroscope has made significant progress using micromechanical technology. Disc resonator gyros (DRG) [1,2] and quadruple mass gyros [3,4] have been focused on in recent years due to the mode-match operating mechanism [5]. The nonfrequency difference between driving and read-out modes means more massive mechanical gain and sensitivity.…”

Section: Introductionmentioning

confidence: 99%

A High Q-Factor Outer-Frame-Anchor Gyroscope Operating at First Resonant Mode

Jiang

et al. 2020

Micromachines

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Disc gyroscope manufactured through microelectromechanical systems (MEMS) fabrication processes becomes one of the most critical solutions for achieving high performance. Some reported novel disc constructions acquire good performance in bias instability, scale factor nonlinearity, etc. However, antivibration characteristics are also important for the devices, especially in engineering applications. For multi-ring structures with central anchors, the out-of-plane motions are in the first few modes, easily excited within the vibration environment. The paper presents a multi-ring gyro with good dynamic characteristics, operating at the first resonant mode. The design helps obtain better static performance and antivibration characteristics with anchor points outside of the multi-ring resonator. According to harmonic experiments, the nearest interference mode is located at 30,311 Hz, whose frequency difference is 72.8% far away from working modes. The structures were fabricated with silicon on insulator (SOI) processes and wafer-level vacuum packaging, where the asymmetry is 780 ppm as the frequency splits. The gyro also obtains a high Q-factor. The measured value at 0.15 Pa was 162 k, which makes the structure have sizeable mechanical sensitivity and low noise.

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Improvements in MEMS gyroscope production as a result of using in situ, aligned, current-limited anodic bonding

Cited by 33 publications

References 3 publications

Joining of engineering ceramics

Joining of engineering ceramics

Industrially Microfabricated Ion Trap with 1 eV Trap Depth

A High Q-Factor Outer-Frame-Anchor Gyroscope Operating at First Resonant Mode

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