2015 Symposium on VLSI Technology (VLSI Technology) 2015
DOI: 10.1109/vlsit.2015.7223675
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In<inf>0.53</inf>Ga<inf>0.47</inf>As MOSFETs with high channel mobility and gate stack quality fabricated on 300 mm Si substrate

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Cited by 14 publications
(10 citation statements)
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“…5(c). These results coincide with the experimental observation from a number of groups that single-domain Ge and III-V layers can be deposited on nominal Si (001) substrates [54,55,[64][65][66][67].…”
Section: Wafer-scale Hetero-epitaxial Growth Of Iii-v Thin Ilms On Sisupporting
confidence: 90%
See 1 more Smart Citation
“…5(c). These results coincide with the experimental observation from a number of groups that single-domain Ge and III-V layers can be deposited on nominal Si (001) substrates [54,55,[64][65][66][67].…”
Section: Wafer-scale Hetero-epitaxial Growth Of Iii-v Thin Ilms On Sisupporting
confidence: 90%
“…Today, 300 mm GaP/Si templates , showing a promising path towards high-eficiency dual-junction GaAsP-on-Si cells. Motivated by the development of III-V channel MOSFETs for high-performance and low-power logic applications, Huang et al [54] and Orzali et al [55] reported epitaxy of smooth In 0.53 Ga 0. 47 As layers on 300 mm Si wafers using metamorphic InP/GaAs bufers by MOCVD.…”
Section: Wafer-scale Hetero-epitaxial Growth Of Iii-v Thin Ilms On Simentioning
confidence: 99%
“…Virtual SiGe [8], Ge and III-V [9] buffer layers on bulk Si wafers have been demonstrated. Typically, 1-2 µm thick layers need to be grown and post-deposition TDD (threading dislocation density) anneals are required to lower the defect density.…”
Section: Ge and Iii-v Integration On Si Substratesmentioning
confidence: 99%
“…To date, defect densities as low as 10 6 cm´2 have been reported for SiGe [8]. Reported defect levels for III-V on 300 mm Si are, however, significantly higher: 1-2ˆ10 9 cm´2 [9]. The latter substrates also require a more complex stack consisting of combinations of GaAs, InP and InAlAs to fabricate the required top InGaAs channels.…”
Section: Ge and Iii-v Integration On Si Substratesmentioning
confidence: 99%
“…Device performance and reliability inevitably suffer from the high-density defects in the hetero-epitaxial III-V materials [14]. To overcome these problems, two main approaches are widely applied for the epitaxy of InP films on Si: one is known as selective area growth (SAG), where InP is grown selectively in the patterning nanometer scale trenches to trap defects at its sidewalls by the defect necking effect [15,16], and the other one is direct growth process by depositing InP directly on blanket Si wafers with metamorphic buffers [17][18][19]. Compared with SAG method, the direct growth process has fewer processing steps without lithography or etching to reduce the risk of contamination.…”
Section: Introductionmentioning
confidence: 99%