2015
DOI: 10.1016/j.solmat.2014.10.018
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Influence of random pyramid surface texture on silver screen-printed contact formation for monocrystalline silicon wafer solar cells

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Cited by 44 publications
(12 citation statements)
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“…The entire emitter surface covered with small silver particles or tiny colloids was the only ideal contact. Surface morphology and defects, including those arising from process conditions, would result in silver particles of different sizes, which will damage the emitter to various extents and block the transport of electrons.…”
Section: Resultsmentioning
confidence: 99%
“…The entire emitter surface covered with small silver particles or tiny colloids was the only ideal contact. Surface morphology and defects, including those arising from process conditions, would result in silver particles of different sizes, which will damage the emitter to various extents and block the transport of electrons.…”
Section: Resultsmentioning
confidence: 99%
“…Dai et al studied SiN X thin film deposition on the surface of a silicon cell and found that the thickness of the SiN X thin film deposited on uniform small pyramids was more uniform than that deposited on other pyramids, and its light trapping and passivation effects were better [10]. Khanna et al studied the influence of random pyramids on the formation of silk-screen-printed silver contacts and found that a larger difference in pyramid height led to a higher contact resistance [11]. A large number of studies have shown that the better the pyramidal texture uniformity is, the better the photoelectric characteristics of the silicon cell are.…”
Section: Introductionmentioning
confidence: 99%
“…Additionally, for both MWSS sc-Si and mc-Si wafers, there are also well-established surface texturing processes available. The current industry standards are an alkali-based process for MWSS sc-Si 4,5,6 and an acid-based process for MWSS mc-Si 7,8,9,10 , the latter of which relies heavily on the formation of thick saw damage on the mc-Si wafer surface during the MWSS process 11,12 .…”
Section: Introductionmentioning
confidence: 99%
“…However, this also makes the texturing of DWS wafers much more complicated than MWSS wafers. While the lack of deep and dense saw damage is not an issue in sc-Si wafers that use alkaline texturing 17 , mc-Si texturing using the standard anisotropic acidic micro-texturing process is not applicable as it is known to require deep saw damage to be effective 6,8,18 . In addition, due to the difference between the acidic and alkaline micro-texturing processes, the equipment used for sc-Si and mc-Si are different.…”
Section: Introductionmentioning
confidence: 99%