Influence of the addition of indium on the mechanical creep of Sn–3.5%Ag alloy

Negm, Samia E.; Mady, H.; Bahgat, A. A.

doi:10.1016/j.jallcom.2010.05.007

Cited by 21 publications

(10 citation statements)

References 17 publications

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“…Saad et al 33 reported that the addition of 1.5 wt.% Ag to Sn-8.8Zn solder alloy increases the creep resistance of the solder. Lower activation energy values of Sn-3.5Ag-8In and Sn-3.5Ag-16In solders were reported by Negm et al 34 compared with Sn-3.5Ag solder. This is possibly attributed to the fact that In added to Sn-3.5Ag solder reduces the melting point and hardness of the solder, and also coarsens the grain size due to the decreased density of the SnAg intermetallic particles in the matrix.…”

Section: Resultsmentioning

confidence: 57%

“…It can be seen that the primary creep stage of the solder alloy is very short compared with the steady-state creep stage, similar to other researchers' results for lead-free solder alloys. [32][33][34] After the primary creep stage of very short duration, a long steady-state (secondary) creep stage follows, occupying most of the creep lifetime. The tertiary creep stage with fast creep strain rate occurs before creep rupture.…”

Section: Methodsmentioning

confidence: 99%

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Creep Properties of Sn-1.0Ag-0.5Cu Lead-Free Solder with Ni Addition

Zhu²,

Poh³

et al. 2011

Journal of Elec Materi

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In this work, tensile creep tests for Sn-1.0Ag-0.5Cu-0.02Ni solder have been conducted at various temperatures and stress levels to determine its creep properties. The effects of stress level and temperature on creep strain rate were investigated. Creep constitutive models (such as the simple power-law model, hyperbolic sine model, double power-law model, and exponential model) have been reviewed, and the material constants of each model have been determined based on experimental results. The stress exponent and creep activation energy have been studied and compared with other researchers' results. These four creep constitutive models established in this paper were then implemented into a user-defined subroutine in the ANSYSä finite-element analysis software to investigate the creep behavior of Sn-1.0Ag-0.5Cu-0.02Ni solder joints of thin fine-pitch ball grid array (TFBGA) packages for the purpose of model comparison and application. Similar simulation results of creep strain and creep strain energy density were achieved when using the different creep constitutive models, indicating that the creep models are consistent and accurate.

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Section: Resultsmentioning

confidence: 57%

Section: Methodsmentioning

confidence: 99%

Creep Properties of Sn-1.0Ag-0.5Cu Lead-Free Solder with Ni Addition

Zhu²,

Poh³

et al. 2011

Journal of Elec Materi

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“…Due to the inherent toxicity of lead (Pb) and Pb-containing alloys, environmental regulations and health concerns around the world have been targeted to eliminate the usage of Pb-bearing solders in the electronic packaging industry [1][2][3]. This has prompted a search for "lead-free" solders and more attention in the research activities in this field.…”

Section: Introductionmentioning

confidence: 99%

Microstructure, kinetic analysis and hardness of Sn–Ag–Cu–1wt% nano-ZrO2 composite solder on OSP-Cu pads

Gain

Fouzder

Chan

et al. 2011

Journal of Alloys and Compounds

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“…Owing to the realization of the inherent toxicity of lead (Pb) and leadcontaining alloys on the environment and human health, increasing efforts have been made to search for suitable lead-free solders as replacement for the conventional Sn-Pb eutectic alloy [1][2][3][4]. Thus, many research groups are concerned with the development of new lead-free solders and their composites.…”

Section: Introductionmentioning

confidence: 99%