Integrated microprobe array and CMOS MEMS by TSV technology for bio-signal recording application

Chou, Lei Chun; Lee, Shih Wei; Huang, Po-Tsang; Chang, Chih Wei; Wu, Shang Lin; Chiou, Jin-Chern; Chuang, Ching Te; Hwang, Wei; Wu, Chung Hsi; Chen, Kuo Hua; Chiu, Chi Tsung; Tong, Ho Ming; Chen, Kuan‐Neng

doi:10.1109/ectc.2014.6897332

Cited by 3 publications

(2 citation statements)

References 16 publications

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“…That is why a process was developed that allowed us to electrically connect both sides of the wafer without having to completely fill the via holes. In [19] signals recorded from probes were also transferred by TSVs through the chip to the CMOS circuits, however in their work, an array of TSVs is assigned to an array of probes (and thus control of a single electrode is not possible), the via is completely filled with Cu and the electrode material chosen is Pt (which is known to have very limited charge injection ability). All of the grown multi-walled carbon nanotubes (MWCNTs) used the base-growth mode, as can be noted by the absence of a catalyst at the tip of the tubes (Fig.…”

Section: Device Fabrication and Carbon Nanotube Synthesismentioning

confidence: 99%

A novel method for the fabrication of a high-density carbon nanotube microelectrode array

Khalifa

Gao

Bermak

et al. 2015

Sensing and Bio-Sensing Research

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a b s t r a c tWe present a novel method for fabricating a high-density carbon nanotube microelectrode array (MEA) chip. Vertically aligned carbon nanotubes (VACNTs) were synthesized by microwave plasma-enhanced chemical vapor deposition and thermal chemical vapor deposition. The device was characterized using electrochemical experiments such as cyclic voltammetry, impedance spectroscopy and potential transient measurements. Through-silicon vias (TSVs) were fabricated and partially filled with polycrystalline silicon to allow electrical connection from the high-density electrodes to a stimulator microchip. In response to the demand for higher resolution implants, we have developed a unique process to obtain a high-density electrode array by making the microelectrodes smaller in size and designing new ways of routing the electrodes to current sources.

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Section: Device Fabrication and Carbon Nanotube Synthesismentioning

confidence: 99%

A novel method for the fabrication of a high-density carbon nanotube microelectrode array

Khalifa

Gao

Bermak

et al. 2015

Sensing and Bio-Sensing Research

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“…The volume of the whole system can be significantly decreased by employing single-chip integration scheme. This can be achieved by the same substrate-integration and through-silicon-vias connectivity (Chou et al, 2014 ; Huang et al, 2014 ; Chang et al, 2015 ). Full system integration was achieved for UEAs integrated with data processing units, power supply, and telemetry link in multi-level hybrid assembly containing flip chip bonding, reflow soldering, and adhesive bonding to form compact standalone package (Kim et al, 2009 ).…”

Section: Assembly Of Neural Interfacesmentioning

confidence: 99%

Neural Interfaces for Intracortical Recording: Requirements, Fabrication Methods, and Characteristics

2017

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Implantable neural interfaces for central nervous system research have been designed with wire, polymer, or micromachining technologies over the past 70 years. Research on biocompatible materials, ideal probe shapes, and insertion methods has resulted in building more and more capable neural interfaces. Although the trend is promising, the long-term reliability of such devices has not yet met the required criteria for chronic human application. The performance of neural interfaces in chronic settings often degrades due to foreign body response to the implant that is initiated by the surgical procedure, and related to the probe structure, and material properties used in fabricating the neural interface. In this review, we identify the key requirements for neural interfaces for intracortical recording, describe the three different types of probes—microwire, micromachined, and polymer-based probes; their materials, fabrication methods, and discuss their characteristics and related challenges.

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Development of in vitro 2D and 3D microelectrode arrays and their role in advancing biomedical research

Didier

Kundu

DeRoo

et al. 2020

J. Micromech. Microeng.

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The development of microelectrode arrays (MEAs) along with complementary advances in electronics, mechanics and software to connect with these arrays has led to the in vitro interfacing and benchtop electrophysiological models of several electrically active cells such as neurons and cardiomyocytes proving vital models and testing of human disease conditions in a dish/on a chip. This topical review deals with the micro/nanofabrication technology development of Microelectrodes Arrays from early silicon based developments to today’s additive manufacturing technologies that have been employed to address bio-micro-electro-mechanical systems tool development in this space. Specifically 2D and 3D MEAs technologies have been reviewed in this paper along with a broad overview of some of the biological applications using these devices that are advancing the very state of biomedical research.

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Integrated microprobe array and CMOS MEMS by TSV technology for bio-signal recording application

Cited by 3 publications

References 16 publications

A novel method for the fabrication of a high-density carbon nanotube microelectrode array

A novel method for the fabrication of a high-density carbon nanotube microelectrode array

Neural Interfaces for Intracortical Recording: Requirements, Fabrication Methods, and Characteristics

Development of in vitro 2D and 3D microelectrode arrays and their role in advancing biomedical research

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