2021
DOI: 10.3390/s21020599
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Interband Cascade Photonic Integrated Circuits on Native III-V Chip

Abstract: We describe how a midwave infrared photonic integrated circuit (PIC) that combines lasers, detectors, passive waveguides, and other optical elements may be constructed on the native GaSb substrate of an interband cascade laser (ICL) structure. The active and passive building blocks may be used, for example, to fabricate an on-chip chemical detection system with a passive sensing waveguide that evanescently couples to an ambient sample gas. A variety of highly compact architectures are described, some of which … Show more

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Cited by 17 publications
(5 citation statements)
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“…Integration of mid-IR light sources (quantum cascade lasers and interband cascade lasers) with PICs have also been demonstrated through both monolithic and hybrid approaches. Photonic packaging in the mid-IR, nonetheless, is still hampered by the fact that most packaging materials, in particular epoxy adhesives, become optically opaque at longer wavelengths . As a result, significant challenges arise for interfacing chip I/O with fiber optics, attachment of micro-optical elements, as well as integration and sealing of fluidic/gas channels .…”
Section: Packaging Considerations For Emerging Applicationsmentioning
confidence: 99%
“…Integration of mid-IR light sources (quantum cascade lasers and interband cascade lasers) with PICs have also been demonstrated through both monolithic and hybrid approaches. Photonic packaging in the mid-IR, nonetheless, is still hampered by the fact that most packaging materials, in particular epoxy adhesives, become optically opaque at longer wavelengths . As a result, significant challenges arise for interfacing chip I/O with fiber optics, attachment of micro-optical elements, as well as integration and sealing of fluidic/gas channels .…”
Section: Packaging Considerations For Emerging Applicationsmentioning
confidence: 99%
“…This typically stems from the mode mismatch and misalignment between the active and passive sections of the chips, i.e., the laser cavity and the passive waveguide. For improving the coupling efficiency between the waveguide and the light sources, the usage of distributed Bragg reflectors (DBR) or appropriate mode profile engineering has been proposed [148]. Separate prototypes of integrations of the laser and the waveguide, the waveguide and the detector, the laser and detector are found in the literature; however, complete integration of all the three components in a single chip is still an active and ongoing pursuit, with very few actual demonstrations.…”
Section: Configurations and Integrationmentioning
confidence: 99%
“…In order to improve the performance further, distributed Bragg reflectors (DBR), high reflectivity coatings, or simply etched or cleaved facets that ensure multiple passes through the active region have been proposed for a waveguide-integrated ICD. Such a design simultaneously increases quantum efficiency, as well as reducing dark current [148].…”
Section: Passive Waveguide and Detector Integrationmentioning
confidence: 99%
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“…Such semiconductor chips would consist of a light source, optical path, and optical detector all integrated into a single photonic integrated circuit (PIC). 1 Current low-cost optical gas sensors use broadband sources, such as thermal IR emitters 2 or LEDs, 3,4 together with optical bandpass filters. Gas concentration is related to the amount of light absorbed by gas molecules in the optical path over the entire broadband spectrum of light measured by the detector.…”
Section: Introductionmentioning
confidence: 99%