Interfacial reactions and mechanical properties between Sn–4.0Ag–0.5Cu and Sn–4.0Ag–0.5Cu–0.05Ni–0.01Ge lead-free solders with the Au/Ni/Cu substrate

In-situ study on growth behavior of Ag3Sn in Sn–3.5Ag/Cu soldering reaction by synchrotron radiation real-time imaging technology

“…Half-line and V shapes were special cases of linear and X shapes. The two special morphologies were in accordance with those of plate-like Ag 3 Sn at the interface reported in literatures [2,3].…”

“…After holding for 30 min, samples were cooled with cooling rate 0.5°C/s. Meanwhile, some of the specimens were ground, polished and etched with a 92:5:3 solutions of CH 3 OH, HNO 3 and HCl to reveal the microstructures. The morphology of IMC formed in the solder and at the interface was observed by scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDS) was used to determine the composition of IMC.…”

“…The formation of Cu 6 Sn 5 and Ag 3 Sn IMC is the core issue for Sn-Ag/Cu solder joint. Much work has been done on the formation and growth of IMC under different conditions for lead-free solder joints [2][3][4]. However, for Sn-Ag solder system when the silver content in is close to or more than eutectic composition, bulk Ag 3 Sn IMC plates are easily formed in the solder matrix or at the interfaces [5][6][7], which degrades the mechanical properties of solder joints [8][9][10].…”

Interfacial microstructure and properties of Sn–0.7Cu–0.05Ni/Cu solder joint with rare earth Nd addition

“…As a consequence, a good metallurgical bond can be achieved. The formation and growth behaviors of IMCs at the interface of joint have been reported extensively in many publications [12][13][14], where it has been stated that the presence of alloying elements in the solders have strong effects on the properties and growth of IMC layers.…”

Interfacial reactions of Pb-free solders with Au/Pd/Ni/brass multilayer substrates

“…Two important laws, such as the waste from electrical and electronic equipment (WEEE) and restriction of hazardous substances directive (RoHs) which were legislated by the European Union (EU), forbid the sale of Pb-containing 3C products since July 1, 2007 [4]. Several Pb-free solders, such as Sn, Sn-3.0 wt% Ag-0.5 wt% Cu (SAC), Sn-0.7 wt% Cu (SC), Sn-58.0 wt% Bi (SB) and Sn-9.0 wt% Zn (SZ) have replaced Sn-Pb solders today [5][6][7][8][9][10][11][12][13][14].…”