Introducing FCA, a new alloy for Power Systems on a chip and Wafer Level Magnetic applications

Liakopoulos, T.M.; Panda, Amrit; Wilkowski, Matthew; Lotfi, A.; Tan, K. H.; Zhang, Li; Lai, C C; Chen, Dong

doi:10.1109/icept-hdp.2012.6474765

Cited by 6 publications

(5 citation statements)

References 10 publications

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“…Electroplating is a less costly method than vacuum deposition techniques and is more suitable for micro-inductor cores with large cross-sectional areas. The films deposited by electroplating have thicknesses of several micro-meters to several tens of micro-meters and include alloys of NiFe with different compositions, such as Ni 80 Fe 20 , Ni 45 Fe 55 , and Ni 50 Fe 50 , and others like CoFeNiC, CoPFe, CoNiFe, CoFeCu, NiFeMo [11,18,19]. With this technique, only conductive materials can be electroplated.…”

Section: Soft Ferrite Cores Characterization For Integrated Micro-ind...mentioning

confidence: 99%

“…A lot of research has been carried out to achieve inductor integration on-chip or in-package. Some demonstrators of air-core inductors, such as thin film magnetic inductors and ferrite based ones, have shown that each integration method has its own merits and difficulties [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15]. For on-chip integration, approaches to the fabrication of micro-inductors involving vacuum deposition and electrodeposition of magnetic cores have been demonstrated over the last thirty years.…”

Section: Introductionmentioning

confidence: 99%

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Soft ferrite cores characterization for integrated micro-inductors

Nguyen¹,

Bourrier²,

Charlot³

et al. 2014

J. Micromech. Microeng.

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Low profile soft ferrite films constitute a competitive solution for the integration of microinductors on silicon in low-power medium frequency DC-DC conversion applications. High resistivity of soft ferrites is indeed a major advantage for operating frequencies in the range of 5-10 MHz. We have studied several soft ferrites including commercial ferrite films and inhouse made ferrites. Test inductors were fabricated at wafer level using micromachining and assembling techniques. The proposed process is based on a sintered ferrite core placed in between thick electroplated copper windings. The low profile ferrite cores of 1.2 × 2.6 × 0.1 mm 3 were produced by two methods issued from green tape-casted films or ferrite powders. This article presents the magnetic characterization of the fabricated ferrite cores cut and printed in rectangular shape and sintered at different temperatures. The comparison is made in order to find out the best material for the core that can offer the micro-inductor a high inductance in the range of 200-1000 nH at 6 MHz and that generate the smallest losses. With commercial ferrite core, it is demonstrated, thanks to a test inductor, that an inductance density of 215 nH.mm-2 up to 6 MHz could be reached. Extracted losses at 6 MHz, under 10 mT are in the range of 0.8 to 2.5 W.cm-3 .

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Section: Soft Ferrite Cores Characterization For Integrated Micro-ind...mentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Soft ferrite cores characterization for integrated micro-inductors

Nguyen¹,

Bourrier²,

Charlot³

et al. 2014

J. Micromech. Microeng.

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“…Power System in Packaging (PSiP) and Power System on Chip (PSoC) are two major approaches for passives integration in modern power systems operated at high frequency range (3)(4)(5)(6)(7)(8)(9)(10)(11)(12)(13)(14)(15)(16)(17)(18)(19)(20). For PSiP, power inductors and other passive components are integrated off chip inside a package.…”

Section: Introductionmentioning

confidence: 99%

“…On the other hand, PSoC is a monolithic integration approach, mostly using MEMS technologies to form power inductors directly on chip. Researchers have reported on-chip inductors employing air cores, sputtered or electroplated magnetic cores, laminated magnetic cores, or composite cores [5][6][7][8][9]. PSoC approaches emphasize on wafer-level batch integration of power inductors, providing minimum sizes and compact interconnections.…”

Section: Introductionmentioning

confidence: 99%

Wafer-Level Fabrication of Power Inductors in Silicon for Compact Dc-Dc Converters

Li¹,

Tseng²,

Xie³

et al. 2014

2014 Solid-State, Actuators, and Microsystems Workshop Technical Digest

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This paper reports the design, fabrication and characterization of a novel power inductor embedded inside a silicon substrate and fabricated at wafer level. Such power inductors in silicon (PIiS) fully explore the capability of forming high-aspect-ratio silicon molds by DRIE for large-cross-section copper winding plating (as thick as the silicon wafers) while also utilizing high-resistivity magnetic composites. By completely using electroplating processes to form the copper coils and vias, the contact resistance between conductive layers can be minimized, and the quality factor can be improved significantly. This process also provides surface mounting pads for a compact converter assembly. Square shaped spiral inductors (3×3×0.83mm 3 ) were successfully fabricated, achieving a large inductance (430 nH), low DC resistance (84 mΩ), and high quality factor (21) at 6 MHz. The fabricated inductors were also assembled with a TI TPS62621 buck converter IC, and an efficiency of 83% was achieved.

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“…However, small device sizes like 1008, 0805, 0603 (EIA size) are needed. Also the device profile becomes less as 0.5 mm or 0.3 mm [3]. Only the new fabrication technology as thin-film technology allows a fulfillment of all these requirements.…”

Section: Introductionmentioning

confidence: 99%

Thin-Film Microtransformer for High Frequency Power Applications

Dinulovic

Gerfer

Opitz

et al. 2014

EPJ Web of Conferences

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Abstract. This paper describes a development of a microtransformer device fabricated using thin film technology. The device is designed for higher switching frequencies beyond to 50 MHz power applications. A especially by the microtransformer is a design, which allows wide flexibility of a device by choosing a different values of an inductance and of a windings ratio. The microtransformer device is integrated on silicon substrate consisting of a closed magnetic core and six coils. Both, primary and secondary device side consist three coils. Therefore, this design allows using of a device for different switching frequencies. As a magnetic material for transformer core a permalloy NiFe45/55 was chosen.

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Introducing FCA, a new alloy for Power Systems on a chip and Wafer Level Magnetic applications

Cited by 6 publications

References 10 publications

Soft ferrite cores characterization for integrated micro-inductors

Soft ferrite cores characterization for integrated micro-inductors

Wafer-Level Fabrication of Power Inductors in Silicon for Compact Dc-Dc Converters

Thin-Film Microtransformer for High Frequency Power Applications

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