2012
DOI: 10.1016/j.mee.2011.05.012
|View full text |Cite
|
Sign up to set email alerts
|

Investigation of silicon nitride charging

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
2

Citation Types

3
8
0

Year Published

2012
2012
2015
2015

Publication Types

Select...
5

Relationship

0
5

Authors

Journals

citations
Cited by 22 publications
(11 citation statements)
references
References 22 publications
3
8
0
Order By: Relevance
“…The existence of such ''fixed'' charges has been also reported in MISS devices with an a-SiN x :H gate quality insulator deposited with PECVD method at 260°C [35], where the shift of C-V characteristics after positive stress revealed a thermally activated mechanism with s = 3.6 Â 10 s. This mechanism has been attributed not to the creation of dangling bond defect states in a-Si:H but to trap states in the a-SiN x :H insulator [35]. The activation energies of the discharging process obtained in this work is in excellent agreement with our previously reported results [9,19] as far as it concerns thermally activated charging mechanisms in SiN x . The fact that charging and discharging processes in MEMS switches are thermally activated means that the parameters affecting the device lifetime are thermally activated too.…”
Section: Resultssupporting
confidence: 91%
See 2 more Smart Citations
“…The existence of such ''fixed'' charges has been also reported in MISS devices with an a-SiN x :H gate quality insulator deposited with PECVD method at 260°C [35], where the shift of C-V characteristics after positive stress revealed a thermally activated mechanism with s = 3.6 Â 10 s. This mechanism has been attributed not to the creation of dangling bond defect states in a-Si:H but to trap states in the a-SiN x :H insulator [35]. The activation energies of the discharging process obtained in this work is in excellent agreement with our previously reported results [9,19] as far as it concerns thermally activated charging mechanisms in SiN x . The fact that charging and discharging processes in MEMS switches are thermally activated means that the parameters affecting the device lifetime are thermally activated too.…”
Section: Resultssupporting
confidence: 91%
“…This activation energy practically coincides with the one obtained from TSDC method in MIM capacitors [9], where above room temperature the TSDC current can be described by:…”
Section: Resultssupporting
confidence: 84%
See 1 more Smart Citation
“…5b). Up to now charging asymmetry has been observed for the case of contacted charging in MIM capacitors and MEMS switches [23][24][25]. The above mentioned results demonstrate for first time that the induced charging in HF PECVD SiN x films is also an asymmetric process.…”
Section: Resultsmentioning
confidence: 62%
“…The build up of parasitic charge is responsible for undesirable switch behavior and limits its lifetime [3][4][5]. Therefore this phenomenon has been studied intensively by several authors employing a variety of techniques [6][7][8][9][10][11][12][13].…”
Section: Introductionmentioning
confidence: 99%