Investigation on Bonding Wire Short Caused by Vibration and Its Solution for High-Density Packaged ICs

Wang, Wenyan; Chen, Zhilong; Yao, Wenjiao; Bai, Shuhua

doi:10.1109/tcpmt.2019.2930023

Cited by 4 publications

(1 citation statement)

References 28 publications

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“…In this study, we focus on wire bonding, which involves welding gold wires onto the inner leads of chips and lead frames. These wires are vital media for electrical connections and signal transmissions between the internal and external circuits of ICs [5][6].…”

Section: Introductionmentioning

confidence: 99%

Process-Quality Evaluation for Wire Bonding With Multiple Gold Wires

Lai

Chen

et al. 2020

IEEE Access

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Taiwan is a world-leader in wafer foundry services and IC packaging and testing. Wire bonding is a crucial process in the overall IC-packaging industry chain. Thus, this paper proposes a processquality evaluation model for wire bonding with multiple gold wires. We chose process quality indices as a tool of evaluation fully mirroring process yield and quality levels. These indices contain unknown parameters and thus require sample data to estimate. We first derived the uniformly minimum variance unbiased estimator of the indices and calculated the upper confidence limits of the indices based on DeMorgan's theorem and Boole's inequality. The upper confidence limits of the indices were then employed to create a confidence interval-based fuzzy membership function, in order to improve the accuracy of estimation as well as solve the problem of uncertainty of the measured data. Next, we obtained the fuzzy critical value and used index estimates and the fuzzy critical value to establish fuzzy test rules. Next, we marked the fuzzy critical value on the axes of a radar chart, which is a visualization evaluation tool, and connected neighboring critical points to create a critical region in the form of a regular polygon. The observed values of the indices were then marked on the axes to produce a visualized fuzzy radar evaluation chart. This fuzzy radar evaluation chart has a solid foundation in statistical inference, and evaluation rules were established using precise fuzzy test methods. Not only is this fuzzy radar evaluation chart easy to use, but it also reduces the chance of misinterpretations made by sampling errors, so that the accuracy of evaluation can be enhanced. INDEX TERMS process quality index, fuzzy critical value, critical region, wire bonding, radar chart.

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Section: Introductionmentioning

confidence: 99%

Process-Quality Evaluation for Wire Bonding With Multiple Gold Wires

Lai

Chen

et al. 2020

IEEE Access

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A novel enhancing method for terahertz imaging of integrated circuits flaw detection

Liu,

Mao,

Yan

et al. 2024

Phys. Scr.

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This research paper addresses the current gap in understanding the intricate damage types within packaged integrated circuits (ICs). We introduce a novel multiscale latent low-rank representation (M-LatLRR) approach, specifically designed to enhance terahertz (THz) IC images and reveal latent features. By integrating THz imaging with our proposed M-LatLRR method, we aim to facilitate the precise identification of damage types within inside the packaged ICs. Firstly, the multiscale Gaussian functions are used to remove the blur and the components are obtained via averaging. Secondly, the image matrices are utilized to extract base matrices and detail matrices. With LatLRR, the multiscale detail matrices are extracted at several representation levels. The final enhanced image is reconstructed by average strategy for dealing with the detail and pre-enhancement parts. The M-LatLRR framework is universal and can be effectively applied to extract multi-level features of packaged IC images. In a comparative analysis, our method demonstrates superior capabilities in determining the failure types of fractured wire bonds, cracks, and delamination of the dielectric layer, outperforming alternative methodologies.

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