In the part I of this paper, the correlation between line-edge roughness (LER) and line-width roughness (LWR) is investigated by theoretical modeling and simulation. In this paper, process-dependence of the correlation between LER and LWR is studied. The experimental results indicate that both Si Fin and nanowire have strongly correlated LER/LWR, and the crosscorrelation of two edges depends on the fabrication process. Based on the improved simulation method proposed in the Part I of this paper, the impacts of correlated LER/LWR in the channel of double-gate devices are investigated. The results show that V th distribution strongly relies on cross-correlation, and can exhibit non-Gaussian distribution and/or multipeak distribution, which enlarges the V th variation.