Laser sintering of Cu nanoparticles on PET polymer substrate for printed electronics at different wavelengths and process conditions

Hernandez-Castaneda, Juan Carlos; Lok, B. K.

doi:10.1007/s11465-019-0562-x

Cited by 18 publications

(11 citation statements)

References 42 publications

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“…Laser sintering is one of the efficient and fast sintering methods for Cu NP inks which uncaps the NPs, induces a merging of the NPs, and creates the required conductivity in contact grids. [50][51][52][53] In this regard, some studies were focused on inkjet printing and sintering of Cu NPs. For instance, Jun et al [54] showed inkjet printing a synthetic NP ink uncapped via thermal annealing with a resistivity of 1.2 Â 10 À6 Ω m. Low sheet resistance of 1 Â 10 À3 Ω □ À1 with a resistivity of 1.2 10 À9 Ω m was realized by adding some Cu complexes to that ink.…”

Section: Laser Sintering: Cu Thickness and Contact Resistivity Of Cu ...mentioning

confidence: 99%

1,8‐Octanedithiol as an Effective Intermediate Layer for Deposition of Cu Electrodes via Inkjet Printing and Laser Sintering on III–V Triple‐Junction Solar Cells

Hayati-Roodbari

Wheeldon

Fian

et al. 2022

Physica Status Solidi (a)

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This research study combines surface modification techniques with back‐end‐of‐line (BEOL) methods for cost‐effective, scalable front contact electrode deposition on III–V solar cells. Copper nanoparticle grids are deposited by inkjet printing on surface‐modified III–V solar cells. The deposition of a self‐assembled monolayer (such as 1,8‐octanedithiol) as an intermediate layer is a proven method for surface modification to improve the wettability of the substrate surface and the adhesion of the printed copper nanoparticle structures on the substrate to perform inkjet printing of coherent and narrow electrode structures. Then, the printed copper ink is converted to a conductive copper grid by a picosecond pulsed laser with optimized settings and an additional galvanic plating step is required for the thickening of inkjet‐printed and laser‐sintered seeding layer for solar cell applications. As a result, an ohmic copper contact on III–V layer with low contact resistivity (5 mΩ cm2) is realized successfully. The processed solar cell shows a functioning behavior with 20% conversion efficiency.

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Section: Laser Sintering: Cu Thickness and Contact Resistivity Of Cu ...mentioning

confidence: 99%

1,8‐Octanedithiol as an Effective Intermediate Layer for Deposition of Cu Electrodes via Inkjet Printing and Laser Sintering on III–V Triple‐Junction Solar Cells

Hayati-Roodbari

Wheeldon

Fian

et al. 2022

Physica Status Solidi (a)

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“…Since the physical properties including optical absorbance and thermal characteristics of the target NP are vastly different according to material [ 95 ], size [ 13 ], and even capping agent [ 96 ], selection of adequate laser parameter is a priority [ 97 ]. To date, a wide range of lasers at different wavelengths and pulse widths has been successfully implemented as sintering sources, while the details of the resultants may vary.…”

Section: Experimental Schemesmentioning

confidence: 99%

Direct Writing of Functional Layer by Selective Laser Sintering of Nanoparticles for Emerging Applications: A Review

et al. 2022

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Selective laser sintering of nanoparticles enables the direct and rapid formation of a functional layer even on heat-sensitive flexible and stretchable substrates, and is rising as a pioneering fabrication technology for future-oriented applications. To date, laser sintering has been successfully applied to various target nanomaterials including a wide range of metal and metal-oxide nanoparticles, and extensive investigation of relevant experimental schemes have not only reduced the minimum feature size but also have further expanded the scalability of the process. In the beginning, the selective laser sintering process was regarded as an alternative method to conventional manufacturing processes, but recent studies have shown that the unique characteristics of the laser-sintered layer may improve device performance or even enable novel functionalities which were not achievable using conventional fabrication techniques. In this regard, we summarize the current developmental status of the selective laser sintering technique for nanoparticles, affording special attention to recent emerging applications that adopt the laser sintering scheme.

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“…For example, in a continuous wave (CW) laser sintering, the metal NPs are fully melted and resolidify due to a relatively longer laser exposure time [30,39,44]. Nanosecond lasers are widely used for sintering [39,45,46] and facilitate the sintering process through a thermal mechanism. The thermal damage, large heat affected zone and low resolution caused by a CW and nanosecond lasers are not desirable for sintering of metal NPs films on heat sensitive materials.…”

Section: Introductionmentioning

confidence: 99%

Ultrashort laser sintering of printed silver nanoparticles on thin, flexible, and porous substrates

Sharif

Farid

McGlynn

et al. 2023

J. Phys. D: Appl. Phys.

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The fabrication of low-cost and mechanically robust flexible electronic patterns has increasingly gained attention due to their growing applications in flexible displays, touch screen panels, medical devices, and solar cells. Such applications require cost-effective deposition of metals in a well-controlled manner potentially using nanoparticles (NPs). The presence of solvent and precursors in NP based inks impacts the electrical conductivity of the printed pattern and a post-processing heating step is typically performed to restore the electrical properties and structure of the material. We report printing with picolitre droplet volumes of silver (Ag) NPs on flexible substrates using an acoustic microdroplet dispenser. The low-cost, controlled deposition of Ag ink is performed at room temperature on photopaper, polyimide and clear polyimide substrates. A localized, ultrashort pulsed laser with minimal heat affected zone is employed to sinter printed Ag patterns. For comparison, oven sintering is performed, and the results are analysed with scanning electron microscopy, four-point probe and Hall measurements. The femtosecond laser sintering revealed highly organized, connected nanostructure that is not achievable with oven heating. A significant decrease in sheet resistance, up to 93% in Ag NPs on clear polyimide confirms the laser sintering improves the connectivity of the printed film and as a result, the electrical properties are enhanced. The surface morphology attained by the laser sintering process is interpreted to be due to a joining of NPs as a result of a solid-state diffusion process in the near surface region of NPs.

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Laser sintering of Cu nanoparticles on PET polymer substrate for printed electronics at different wavelengths and process conditions

Cited by 18 publications

References 42 publications

1,8‐Octanedithiol as an Effective Intermediate Layer for Deposition of Cu Electrodes via Inkjet Printing and Laser Sintering on III–V Triple‐Junction Solar Cells

1,8‐Octanedithiol as an Effective Intermediate Layer for Deposition of Cu Electrodes via Inkjet Printing and Laser Sintering on III–V Triple‐Junction Solar Cells

Direct Writing of Functional Layer by Selective Laser Sintering of Nanoparticles for Emerging Applications: A Review

Ultrashort laser sintering of printed silver nanoparticles on thin, flexible, and porous substrates

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