Latest results and computing performance of the ePLACE data preparation tool

Abstract

At the EMLC 2009 in Dresden the data preparation package ePLACE was already presented. This package has been used for quite different applications covering mask write, direct write and special applications. In this paper we will disclose results achieved when using the ePLACE package for processing of layout data of immediate interest. During the evaluation phase of the new solution we could benefit from broad experience we collected over many years with the fracture performance of the MGS software, which is one core element of today's ePLACE package. A key interest of this paper is the investigation of the scalability of computing solutions as a cost-effective approach when processing huge data volumes with the new solution. This is reflected against current state-of-the-art data processing tasks being part of both mask write and direct write applications. Furthermore, we evaluated visualization and simulation possibilities of the ePLACE package with respect to its use with latest layouts in various applications. The improved performance of the data preparation package including its adaptation to new e-beam lithography options, as, for instance, the incorporation of the cell projection capability or the newly developed Multi Shaped Beam (MSB) technology, will be also discussed. As an example the matching of the data path with a Vistec SB3055 will be outlined. Processing of Design For E-Beam (DFEB) data (including cell contents) and their conversion to real exposure data is reported. The advantages of the parallel use of standard shaped beam und cell projection technologies are highlighted focussing on latest writing time yields achieved when applying the CP feature

Multi-shaped e-beam technology for mask writing

“…Thanks to these software tools, it is possible to determine the exact number of shots to be exposed. Based on this and as described in [4] , it is possible to simulate the write time in taking into account the resist sensitivity, the beam current density and, the PEC. For all layouts described in chapter 3 the corresponding values were determined.…”

“…A comprehensive layout data preparation package including proximity effect correction (PEC) is provided by EQUIcon / Vistec and available for all Vistec shaped beam writers as well as for the new MSB generation [3] , [4] . Thanks to these software tools, it is possible to determine the exact number of shots to be exposed.…”

“…Based on a common Vistec tool platform, it will be possible to configure direct write tools for wafers up to 450mm in diameter and photomask writers with a smaller square stage system. This prompted a close examination of the entire data preparation path for very different mask and direct write applications [3] , [4] . Shot count reductions are clearly demonstrated with MSB technology when compared to the (single) standard shaped beam mask writer approach as shown in the later results.…”

Geometrically induced dose correction: method and performance results

“…In previous studies we have shown by means of the ePLACE simulation feature [6,7] that the geometrically induced dose correction method provides a possibility to significantly enhance the dose distribution contrast and DST [8]. To demonstrate the achievable improvements, we have performed test exposures.…”