2016
DOI: 10.1016/j.microrel.2016.07.141
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Lifetime estimation for IGBT modules in wind turbine power converter system considering ambient temperature

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Cited by 27 publications
(5 citation statements)
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“…Another dominant failure mechanism of the standard wire-bonded IGBT modules is the solder joint fatigue under shear stress, see Fig. 16b [147].…”
Section: Fatigue Reliability On Power Electronic Componentsmentioning
confidence: 99%
“…Another dominant failure mechanism of the standard wire-bonded IGBT modules is the solder joint fatigue under shear stress, see Fig. 16b [147].…”
Section: Fatigue Reliability On Power Electronic Componentsmentioning
confidence: 99%
“…The SM fatigue damage analysis first needs to collect the mission profile of MMC operation [20,21]. Including power loss, device junction temperature, device related thermal parameters, etc.…”
Section: Sm Fatigue Damage Analysis Flowmentioning
confidence: 99%
“…Similarly, the total loss of the diode 𝑃 𝐷,𝑙𝑜𝑠𝑠 is the sum of on-state loss 𝑃 𝐷,𝑐𝑜𝑛𝑑 and reverse recovery loss 𝑃 𝐷,𝑟𝑒𝑐 . Equations ( 1) and ( 2) are conducted in detail based on circuit theory in [21,26].…”
Section: Igbt Diode Fatigue Damage Analysismentioning
confidence: 99%
“…Then, the power is switched off until the temperature is decreased to a minimum value. The power cycling capability of the device can be evaluated by performing the intermittent life test, and the reliability of device suffering from various temperature fluctuations can be further estimated [24], [25].…”
Section: A Test Bench For Intermittent Life Testmentioning
confidence: 99%