2002
DOI: 10.1117/12.473425
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Line-profile and critical-dimension correlation between a normal-incidence optical CD metrology system and SEM

Abstract: Process tolerances for critical dimensions are becoming increasingly severe as lithographic technology drives the minimum integrated-circuit feature size toward 0.1 µm and below. In response, Optical Critical Dimension metrology (OCD), an optical-wavelength light-diffraction technique, is currently undergoing an industry-wide evaluation as a fast, accurate, and non-destructive sub-100nm line-width monitor. As such, a detailed understanding of the correlation between CD-SEM and OCD measurements is required. Cor… Show more

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Cited by 7 publications
(5 citation statements)
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“…Optical imaging systems have commonly been used for measuring critical dimensions only slightly smaller than the dominant wavelength in the illumination beam [13]- [17]. The development of the microelectronics industry has created the need for reliable metrology techniques to characterize chip microstructures.…”
Section: Introductionmentioning
confidence: 99%
“…Optical imaging systems have commonly been used for measuring critical dimensions only slightly smaller than the dominant wavelength in the illumination beam [13]- [17]. The development of the microelectronics industry has created the need for reliable metrology techniques to characterize chip microstructures.…”
Section: Introductionmentioning
confidence: 99%
“…The profiles monitored by OCD show a close match to X-SEM profile images. [1] As technology nodes continuously advance, the 3D applications of OCD metrology arouse more attentions in in-situ monitoring for those more complicated or 3D structures such as contact hole (CT), via hole, dual-damascene (DD), FinFET, metal gate fill/polishing, overlay and ADI of double patterning process.…”
Section: Introductionmentioning
confidence: 99%
“…To enhance the mobility of p-MOSFET, a local approach, where stress is engineered into the device by means of epitaxial layers and/or high-stress nitride capping layers, has been widely employed [1] as shown in Fig. 2.…”
Section: Introductionmentioning
confidence: 99%
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“…The semiconductor industry has capitalized on this sensitivity to measure line widths and profiles of microfabricated structures. [1][2][3][4][5][6][7][8] Referred to as non-imaging optical critical dimension metrology (OCD), measurements generally consist of recording the reflectance or polarization as a function of incident angle or wavelength from a periodic test structure. Comparison of the measurement with a library of simulated results for a variety of different possible profiles yields the one which matches the data best.…”
Section: Introductionmentioning
confidence: 99%