Low-power-consumption optical interconnect on silicon by transfer-printing for used in opto-isolators

Abstract

On-chip optical interconnects heterogeneously integrated on silicon wafers by transfer-print technology are presented for the first time. Thin (<5 μm), micron sized light-emitting diodes (LEDs) and photo diodes (PDs) are prefabricated and transfer-printed to silicon wafer with polymer waveguides built between them. Data transmission with total power consumption as low as 1 mW, signal to noise ratio of >250 and current transfer ratio of 0.1% in a compact volume of <0.0004 mm 3 are demonstrated. Experiment shows that the polymer waveguide between the LED and PD plays a key role in enhancing the data transmission efficiency. Reciprocal performance for bidirectional transmission is also achieved. The results show the potential for cost-effective and low profile form-factor on-chip opto-isolators.

Edge-Coupling of O-Band InP Etched-Facet Lasers to Polymer Waveguides on SOI by Micro-Transfer-Printing

“…The integration of active photonic devices on SOI has been successfully accomplished by die/wafer bonding [11]- [16] and more recently by micro-transfer-printing (μTP) [17]- [19]. In particular, InP-based Fabry-Perot and DFB lasers, LEDs, and photodiodes have been heterogeneously integrated with silicon photonics by using μTP [20]- [23]. Heterogeneous integration by μTP offers high-throughput, parallel and scalable transfer of devices or dies of material in the desired locations on the integration platform.…”

Literature Review of Optocouplers, Their polymer Components and Current Applicaitons

“…Optocouplers, also called optoisolators, and photocouplers, are devices that employ two simple components for conducting an electric current: light-emitting diodes (LEDs) and a transistor, specifically a phototransistor. 1 Transistors are an essential part of most modern electrical devices because they are used extensively in memory chips. There are thousands of them in almost every electronic device.…”