Low profile fan and heat sink thermal management solution for portable applications

Walsh, Edmond J.; Grimes, Ronan

doi:10.1016/j.ijthermalsci.2007.03.010

Cited by 36 publications

(10 citation statements)

References 19 publications

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“…In heat transfer applications, this has been primarily driven by advances in microprocessor performance, as the computing industry is currently curtailed by increased heat flux levels due to reduced die size and increased numbers of transistors. This problem of elevated heat flux has led numerous researchers to investigate many novel air cooled heat sink designs [1][2][3][4] and to examine the efficiency of blade geometry in the miniature fans required [5,6]. Also, the advent of microchannel technology has lead to the development of numerous liquid cooling devices, such as cold plates for processor cooling, and compact heat exchangers for industrial applications.…”

Section: Introductionmentioning

confidence: 99%

Heat transfer model for gas–liquid slug flows under constant flux

Walsh

Muzychka

2010

International Journal of Heat and Mass Transfer

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Section: Introductionmentioning

confidence: 99%

Heat transfer model for gas–liquid slug flows under constant flux

Walsh

Muzychka

2010

International Journal of Heat and Mass Transfer

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“…Hence, heat is ultimately removed by some combination of natural convection, conduction and radiation. Novel, low profile finless heat sink designs with active cooling and heights of less than five millimeters have been studied in terms of heat sink designs by Walsh et al [5], Walsh and Grimes [6], and the importance of flow field at the exit of small scale fans of low profile, Egan et al [7,8] and the position of chip placement in the case of axial flow fans, Stafford et al [9].…”

Section: Accepted Manuscriptmentioning

confidence: 99%

Active cooling of a mobile phone handset

Grimes

Walsh

2010

Applied Thermal Engineering

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Power dissipation levels in mobile phones continue to increase due to gaming, higher power applications, and increased functionality associated with the internet. The current cooling methodologies of natural convection and radiation limit the power dissipation within a mobile phone to between 1-2 W depending on size. As power dissipation levels increase, products such as mobile phones will require active cooling to ensure that the devices operate within an acceptable temperature envelop from both user comfort and reliability perspectives. In this paper, we focus on the applied thermal engineering problem of an active cooling solution within a typical mobile phone architecture by implementing a custom centrifugal fan within the mobile phone. Its performance is compared in terms of flow rates and pressure drops, allowable phone heat dissipation and maximum phone surface temperature as this is the user constraint for a variety of simulated PCB architectures in the mobile phone. Perforated plates with varying porosity through different size orifices are used to simulate these architectures. The results show that the power level dissipated by a phone for a constant surface temperature may be increased by ~50 -75% depending on pressure drop induced by the internal phone architecture. Hence for successful implementation and efficient utilization of active cooling will require chip layout to be considered at the design stage.

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“…The conventional methods such as air-cooling, heat pipes, vapour chambers, jet impingement, and thermoelectric cooling [4][5][6][7][8][9] seem to have reached their practical limits creating the need for new cooling techniques. For power dissipation by heat fluxes above 1 MW/m 2 , liquid immersion and liquid cooling using microchannel cooling device are the most suitable [10].…”

Section: Introductionmentioning

confidence: 99%

Numerical Study on the Performance of Double Layer Microchannel with Liquid Gallium and Water

Sharma

Garg

Singh

et al. 2013

Advances in Mechanical Engineering

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The performance of liquid gallium and water in the double layer microchannel has been analysed using three-dimensional conjugate heat transfer analysis. The effect of flow rate on the counter and parallel arrangement of each fluid is studied for three different lengths. Furthermore, cooling capability of liquid gallium and water is compared at the same length with flow rate and pumping power as governing parameters. The performance of fluid was judged on the basis of maximum temperature attained and minimal temperature variations at the heated region. Interesting results have been found showing the effect of specific heat on the type of arrangement for liquid gallium with similar observation for water for low Reynolds number and relatively longer length. Among liquid gallium and water, above certain pumping power use of liquid gallium is found to be favourable for a shorter length of the double layer microchannel. Furthermore, the range of flow rate and pumping power showing superior performance with water was found to increase with the length.

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Low profile fan and heat sink thermal management solution for portable applications

Cited by 36 publications

References 19 publications

Heat transfer model for gas–liquid slug flows under constant flux

Heat transfer model for gas–liquid slug flows under constant flux

Active cooling of a mobile phone handset

Numerical Study on the Performance of Double Layer Microchannel with Liquid Gallium and Water

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