&lt;title&gt;Diamond turning of silicon optics&lt;/title&gt;

Parr-Burman, P.; Shore, Paul

doi:10.1117/12.246793

Cited by 9 publications

(6 citation statements)

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“…Nanometrically-smooth infrared silicon optics can be manufactured by the diamond turning process [1] [2]. Due to its relatively low mass density, single crystal silicon is an ideal optical material for weight sensitive infrared (IR) applications.…”

Section: Introductionmentioning

confidence: 99%

3D characterisation of tool wear whilst diamond turning silicon

Durazo-Cardenas

Shore

Luo

et al. 2007

Wear

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Nanometrically-smooth infrared silicon optics can be manufactured by the diamond turning process. Due to its relatively low density, silicon is an ideal optical material for weight sensitive infrared (IR) applications. However, rapid diamond tool edge degradation and the effect on the achieved surface have prevented significant exploitation. With the aim of developing a process model to optimise the diamond turning of silicon optics, a series of experimental trials were devised using two ultra-precision diamond turning machines. Single crystal silicon specimens <1, 1, 1> were repeatedly machined using diamond tools of the same specification until the onset of surface brittle fracture. Two cutting fluids were tested. The cutting forces were monitored and the wear morphology of the tool edge was studied by scanning electron microscopy (SEM).

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Section: Introductionmentioning

confidence: 99%

3D characterisation of tool wear whilst diamond turning silicon

Durazo-Cardenas

Shore

Luo

et al. 2007

Wear

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“…Important research into the diamond machining of hard and brittle materials such as silicon and germanium was undertaken by many [30][31][32][33]. Collectively, their work established today's production methods for the fabrication of infrared (IR) optics as applied in missile guidance systems, heat-seeking detection cameras and night vision sights [34]. Materials ostensibly considered brittle, such as silicon, can today readily be turned without brittle fracture owing to the quality of control of the cut chip thickness using high-quality lathes.…”

Section: (A) Single-point Diamond Machiningmentioning

confidence: 99%

Ultra-precision: enabling our future

Shore

Morantz

2012

Phil. Trans. R. Soc. A.

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This paper provides a perspective on the development of ultra-precision technologies: What drove their evolution and what do they now promise for the future as we face the consequences of consumption of the Earth’s finite resources? Improved application of measurement is introduced as a major enabler of mass production, and its resultant impact on wealth generation is considered. This paper identifies the ambitions of the defence, automotive and microelectronics sectors as important drivers of improved manufacturing accuracy capability and ever smaller feature creation. It then describes how science fields such as astronomy have presented significant precision engineering challenges, illustrating how these fields of science have achieved unprecedented levels of accuracy, sensitivity and sheer scale. Notwithstanding their importance to science understanding, many science-driven ultra-precision technologies became key enablers for wealth generation and other well-being issues. Specific ultra-precision machine tools important to major astronomy programmes are discussed, as well as the way in which subsequently evolved machine tools made at the beginning of the twenty-first century, now provide much wider benefits.

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“…The silicon blocks are polished smoothly to be applicable as optical surfaces [3][4][5][6][7][8][9][10], which in turn are cut by wire electrical discharge machining (WEDM) to the desired contour [11][12][13]. This procedure requires the smoothness and shape accuracy of the polished surface to be degraded as little as possible by WEDM in order to achieve superior optical performance.…”

Section: Introductionmentioning

confidence: 99%