Material System Solution for 3D Package

Takekoshi, Masaaki; Suzuki, Norihiro; Ose, Masahisa; Ikeuchi, Takatoshi

doi:10.5104/jiep.15.148

Cited by 4 publications

(2 citation statements)

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“…Moreover, in order to implement the trends of advanced integrated packages, an application processor (AP) controlling all functions of mobile devices is believed to be one of the key devices to do so. Thus far, most APs are integrated by Package on Package (PoP) technology, which includes considerable thick substrate for mounting devices [1]. In the recent package trend, Fan-Out Wafer Level Package (FO-WLP) technology became a remarkable package technology, which opened-up a technological window to manufacture extremely thin devices [2].…”

Section: Introductionmentioning

confidence: 99%

Low Stress and Low Temperature Curable Photosensitive Polyimide

Shoji

Hashimoto

Koyama

et al. 2021

J. Photopol. Sci. Technol.

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Section: Introductionmentioning

confidence: 99%

Low Stress and Low Temperature Curable Photosensitive Polyimide

Shoji

Hashimoto

Koyama

et al. 2021

J. Photopol. Sci. Technol.

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“…Along with high performance of electronic devices typified by recent mobile phones, high density and integration of semiconductor devices have been promoted [1][2][3][4][5]. In three-dimensional mounting, which is one of the integration technologies, a technique of conducting a semiconductor element by using a wire and a microelectrode (bump) is used [6,7]. Bumps are made by electrolytic plating, and a resist is used as a template [8][9][10].…”

Section: Introductionmentioning

confidence: 99%

Development of Dissolution Inhibitor in Chemically Amplified Positive Tone Thick Film Resist

Sotokawa

Nishiyama

Sato

et al. 2018

J. Photopol. Sci. Technol.

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Thick film resist is applied to a template for microelectrode used in semiconductor device integration. Utilization of positive type resist in chemically amplified system for thick film is expected to improve production efficiency of semiconductor device integration, but improvement of resolution is required. In order to improve the resolution of chemically amplified positive tone thick film resist, chemical structure of the dissolution inhibitor (DI) was designed for the control of solubility in resist polymer. The increase of molecular size in DI improved the dissolution inhibiting ability for the resist polymer in the unexposed area and the high acidity of the deprotected DI having carboxyl group improved dissolution promoting ability for the resist polymer in the exposed area. The resist containing DI possessing a large molecular size and high acidity improved its sensitivity and resolution.

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