Mechanical characterisation of thin metal layers by modelling of the nanoindentation experiment

Wittler, Olaf; Mrossko, R.; Kaulfersch, E.; Wunderle, Bernhard; Michel, B.

doi:10.1109/estc.2008.4684488

Cited by 7 publications

(4 citation statements)

References 6 publications

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“…This could also be associated to the simplifications done by bilinear elasticplastic laws [10]. In such cases a nonlinear material law resulted in improved results [4,11]. Despite this improvement our new results outlined below still show no uniqueness of the derived plastic material data.…”

Section: Introductionmentioning

confidence: 57%

“…A typical approach is the nanoindentation experiment, which results typically in the characterisation of modulus and hardness [2]. In order to achieve stressstrain curves the approach is typically being extended by matching indentation curves from nonlinear finite element simulation and experiment [3,4]. In most publications the approach is characterised by trial and error, which leaves the results not to be well defined, because the person doing the data fit influences the result.…”

Section: Introductionmentioning

confidence: 99%

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Characterisation and modelling of the nanoindentation experiment in Au layers

Wittler

Mrossko²,

Huber

et al. 2009

EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelect

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The nanoindentation experiment is an established technique for the determination of Hardness and Young's modulus of thin films. This standard data set is not sufficient to he used as input to finite element simulations, because elastic-plastic material data is being required for analysis of reliability of metal layers. Therefore stress-strain Curves are being determined by fitting the force displacement curves of the experiment with a finite-element model. Additionally this approach enables a solution for the so called substrate effect , because the stiffness of the Substrate can be considered in the fitting model. This known approach is being applied and tested on thin (< 500 nm) gold layers deposited on silicon. It is shown that even for indents that exceed 10 % of the film thickness a good sensitivity for Young's Modulus can be reached, but for the plastic data the results are not unique and a range of plastic properties can be fitted. It is shown, that this problem of the method can be solved by correlation of the indent profiles

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Section: Introductionmentioning

confidence: 57%

Section: Introductionmentioning

confidence: 99%

Characterisation and modelling of the nanoindentation experiment in Au layers

Wittler

Mrossko²,

Huber

et al. 2009

EuroSimE 2009 - 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelect

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show abstract

“…In this case, the determination of material model parameters is additionally supported using an artificial neural network. The evaluation of the mechanical properties of thin metal coatings using indentation simulation is devoted to the work of Wittler et al [40]. The Pöhl study presents a method for determining the basic mechanical properties of the test material [41].…”

Section: Methods For the Determination Of Machined Layers Mechanical ...mentioning

confidence: 99%

Mechanical Characteristics Generation in the Workpiece Subsurface Layers through Cutting

Storchak

2023

Crystals

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The cutting process generates specific mechanical characteristics in the subsurface layers of the shaped parts. These characteristics have a decisive influence on the working properties and product durability of these parts. The orthogonal cutting process of structural heat-treated steel’s effect on the mechanical properties of the machined subsurface layers was evaluated by instrumented the nanoindentation method and sclerometry (scratch) method. As a result of this study, the relationship between the specific work in the tertiary cutting zone and the total deformation work during indenter penetration during the instrumented nanoindentation was established. The dependence of the indenter penetration depth during sclerometry of the machined subsurface layers of the workpiece was also studied. The orthogonal cutting process was carried out at different cutting speeds and tool rake angles. The cutting speed increase and the increase in the tool rake angle cause an increase in the indenter penetration work during the instrumented nanoindentation and an increase in the maximum indenter penetration depth during sclerometry. Simultaneously, the measured microhardness of the machined surfaces decreases with both an increase in cutting speed and an increase in the tool rake angle.

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“…19, it is tempting to use nano-indentation for that purpose and fit a three-parameter elastoplastic constitutive law to the curve and iterate until convergence is reached (Wunderle et al 2006b;Wittler et al 2008) based on the Oliver-Pharr scheme (Oliver and Pharr 1992) (Fig. 20).…”

Section: Nano-reliabilitymentioning

confidence: 99%

Lifetime modelling for microsystems integration: from nano to systems

Wunderle

Michel

2009

Microsyst Technol

Self Cite

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Due to the rapid development of IC technology the traditional packaging concepts are making a transition into more complex system integration techniques in order to enable the constantly increasing demand for more functionality, performance, miniaturisation and lower cost. These new packaging concepts (as e.g. system in package, 3D integration, MEMS-devices) will have to combine smaller structures and layers made of new materials with even higher reliability. As these structures will more and more display nano-features, a coupled experimental and simulative approach has to account for this development to assure design for reliability in the future. A necessary ''nano-reliability'' approach as a scientific discipline has to encompass research on the properties and failure behaviour of materials and material interfaces under explicit consideration of their micro-and nano-structure and the effects hereby induced. It uses micro-and nano-analytical methods in simulation and experiment to consistently describe failure mechanisms over these length scales for more accurate and physically motivated lifetime prediction models. This paper deals with the thermo-mechanical reliability of microelectronic components and systems and methods to analyse and predict it. Various methods are presented to enable lifetime prediction on system, component and material level, the latter promoting the field of nano-reliability for future packaging challenges in advanced electronics system integration.

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Mechanical characterisation of thin metal layers by modelling of the nanoindentation experiment

Cited by 7 publications

References 6 publications

Characterisation and modelling of the nanoindentation experiment in Au layers

Characterisation and modelling of the nanoindentation experiment in Au layers

Mechanical Characteristics Generation in the Workpiece Subsurface Layers through Cutting

Lifetime modelling for microsystems integration: from nano to systems

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