2020
DOI: 10.1039/d0dt02207a
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Metal organic framework top-down and bottom-up patterning techniques

Abstract: Metal organic frameworks (MOFs) have recently attracted considerable research interest in several fields from coordination chemistry and materials science to engineering and medicine due to energy and environmental issues but...

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Cited by 26 publications
(15 citation statements)
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“…Yet, solvent-free approaches for patterning are currently at the forefront of technological needs due to their great potential in improving wafer processing efficiency and patterning quality at reduced material and energy cost 32 . Although solvent-free MOF deposition steps have been incorporated in lift-off patterning 33,34 , fully solvent-free bottom-up patterning of MOFs will further facilitate their application in microfabrication processes.…”
mentioning
confidence: 99%
“…Yet, solvent-free approaches for patterning are currently at the forefront of technological needs due to their great potential in improving wafer processing efficiency and patterning quality at reduced material and energy cost 32 . Although solvent-free MOF deposition steps have been incorporated in lift-off patterning 33,34 , fully solvent-free bottom-up patterning of MOFs will further facilitate their application in microfabrication processes.…”
mentioning
confidence: 99%
“…For weak interactions between adjacent layers, the original 3D structure can be transformed into a 2D structure by exfoliation through ultrasound, vibration, and mechanics. [84][85][86] Especially in the preparation of MOF nanosheets, the top-down MOF nanosheet preparation method is less limited and more applicable compared with other methods.…”
Section: Top-down Methodsmentioning
confidence: 99%
“…Integration of MOFs with flexible electronic devices may start with downsizing MOFs particles into micro/nano-particles, which not only can preserve the same pore structures and surface reactivity as the bulky materials, but also can achieve MOFs thin films that match the mechanical properties of flexible electronics. The downsizing methods can be categorized into top-down and bottom-up approaches [363][364][365][366][367].…”
Section: Approaches For Downsizing Mofsmentioning
confidence: 99%