Method for electroless nickel plating on poly(ethylene terephthalate) substrates and through holes modified with primer

Huang, Junjun; Sun, Zhiping; Zhou, Fang; Yuan, Yuan; Chen, Wei; Gao, Min; Chen, Zhenming

doi:10.1007/s10854-017-6878-6

Cited by 3 publications

(1 citation statement)

References 21 publications

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“…The peak at 1104 cm –1 is ascribed to the ester group (C(O)–O) stretching vibration . The peak at 1717 cm –1 is attributed to carbonyl group (CO) stretching vibration. , The stretching vibration of hydroxyl groups (−OH) is observed at approximately 2970 cm –1 . − The signals of these modes demonstrate that the surface of PET contains a large amount of carbonyl (CO) and (−OH) hydroxyl groups. Furthermore, hydroxyl groups in the PET film can react with epoxy groups from the Ag + complex at room temperature forming covalent bonds (eq ) reported in the literature. , However, carbonyl groups cannot react directly with epoxy groups.…”

Section: Resultsmentioning

confidence: 99%

Compatible Ag⁺ Complex-Assisted Ultrafine Copper Pattern Deposition on Poly(ethylene terephtalate) Film with Micro Inkjet Printing

Wang

Yan

Zhou

et al. 2019

ACS Appl. Mater. Interfaces

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Firm immobilization of catalysts on the predesigned position over substrates is an essential process for producing flexible circuits by the electroless deposition (ELD) process. In this work, a compatible Ag + complex was developed and directly printed on the poly(ethylene terephtalate) (PET) film through a micro inkjet printing instrument to trigger the deposition of ultrafine copper patterns with approximately 20 μm in width. Morphological and elementary characterization verified that the nanosized silver catalyst was uniformly distributed in the bridge layer, which could enhance the adhesion between the PET film and deposited copper patterns. Moreover, after 30 min of ELD, the copper patterns exhibited a low resistivity of 2.68 × 10 −6 Ω•cm and maintained considerable conductivity even after 2000 times of cyclical bending. These interesting conductive and mechanical features demonstrate the tremendous potential of this Ag + complex-assisted copper deposition in the interconnection of high-density integrated flexible electronics.

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Section: Resultsmentioning

confidence: 99%

Compatible Ag⁺ Complex-Assisted Ultrafine Copper Pattern Deposition on Poly(ethylene terephtalate) Film with Micro Inkjet Printing

Wang

Yan

Zhou

et al. 2019

ACS Appl. Mater. Interfaces

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Two‐component acrylic structural adhesive initiated by tributylborane for untreatedPETadhesion

Zhang

Wang

2018

J of Applied Polymer Sci

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In order to improve the adhesion strength of acrylic adhesive to untreated poly(ethylene terephthalate) (PET) substrate, two-component acrylic structural adhesives initiated by tributylborane were prepared. The effects of acrylic monomers, elastomers, decomplexers, and oligomers on the adhesion properties of two-component acrylic structural adhesive were investigated in sequence. It is found that the shear strength on PET of adhesives toughened by acrylonitrile-butadiene-styrene copolymer and carboxylterminated butadiene-acrylonitrile copolymer is higher than that of commercial adhesives Dp8010NS and Loctite 3030. A tailored oligomer was synthesized from hydroxyl propyl-terminated polydimethylsiloxane and 3-isopropenyl-a,a-dimethylbenzyl isocyanate. It is also noticed that premature failure usually takes place in the lap shear test samples due to the brittleness of the acrylic adhesive, except in the sample of adhesive modified by tailored oligomer. Excellent adhesion to the PET substrate is achieved by this adhesive modified by tailored oligomer, with a lap shear strength above 11 MPa and T-peel strength up to 5.34 N/mm. Additionally, the resulting adhesive is qualified for the structural bonding of PET materials.

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Investigation of process parameters in electroless copper plating on polystyrene

Dev¹,

Tandon²,

Jha³

et al. 2020

Sādhanā

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Method for electroless nickel plating on poly(ethylene terephthalate) substrates and through holes modified with primer

Cited by 3 publications

References 21 publications

Compatible Ag⁺ Complex-Assisted Ultrafine Copper Pattern Deposition on Poly(ethylene terephtalate) Film with Micro Inkjet Printing

Compatible Ag⁺ Complex-Assisted Ultrafine Copper Pattern Deposition on Poly(ethylene terephtalate) Film with Micro Inkjet Printing

Two‐component acrylic structural adhesive initiated by tributylborane for untreatedPETadhesion

Investigation of process parameters in electroless copper plating on polystyrene

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Method for electroless nickel plating on poly(ethylene terephthalate) substrates and through holes modified with primer

Cited by 3 publications

References 21 publications

Compatible Ag+ Complex-Assisted Ultrafine Copper Pattern Deposition on Poly(ethylene terephtalate) Film with Micro Inkjet Printing

Compatible Ag+ Complex-Assisted Ultrafine Copper Pattern Deposition on Poly(ethylene terephtalate) Film with Micro Inkjet Printing

Two‐component acrylic structural adhesive initiated by tributylborane for untreatedPETadhesion

Investigation of process parameters in electroless copper plating on polystyrene

Contact Info

Product

Resources

About

Compatible Ag⁺ Complex-Assisted Ultrafine Copper Pattern Deposition on Poly(ethylene terephtalate) Film with Micro Inkjet Printing

Compatible Ag⁺ Complex-Assisted Ultrafine Copper Pattern Deposition on Poly(ethylene terephtalate) Film with Micro Inkjet Printing