2021
DOI: 10.1016/j.solmat.2021.111182
|View full text |Cite
|
Sign up to set email alerts
|

Microstructure beneath screen-printed silver contacts and its correlation to metallization-induced recombination parameters

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2022
2022
2023
2023

Publication Types

Select...
5

Relationship

0
5

Authors

Journals

citations
Cited by 5 publications
(1 citation statement)
references
References 22 publications
0
1
0
Order By: Relevance
“…Although the industry will continue to rely on p-type wafers as the base material in the near future, there are manufacturers already today that are moving to n-type wafer-based concepts [5]. Regardless of which base material is used, most solar cells use an emitter of the other polarity on the front side covered by a passivation and antireflection layer [6,7]. For industrially manufactured electrodes, different metal pastes are deposited by screen printing.…”
Section: Introductionmentioning
confidence: 99%
“…Although the industry will continue to rely on p-type wafers as the base material in the near future, there are manufacturers already today that are moving to n-type wafer-based concepts [5]. Regardless of which base material is used, most solar cells use an emitter of the other polarity on the front side covered by a passivation and antireflection layer [6,7]. For industrially manufactured electrodes, different metal pastes are deposited by screen printing.…”
Section: Introductionmentioning
confidence: 99%