Microstructures and properties of Sn58Bi, Sn35Bi0.3Ag, Sn35Bi1.0Ag solder and solder joints

Zhang, Liang; Sun, Lei; Guo, Yong-huan

doi:10.1007/s10854-015-3400-x

Cited by 34 publications

(13 citation statements)

References 17 publications

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“…Shalaby [48] found that the addition of In elements had critical effect on the onset point of the Sn-58Bi solder which meant that adding 2 wt.% In could decrease the onset point of the solder from 139.06 ∘ C to 129.68 ∘ C. But the onset point of the Sn-58Bi solder with addition of 2 wt.% Ag elements did not change remaining at 139.06 ∘ C. So it was considered that the 2 wt.% Ag addition had little effect on the onset point of the Sn-58Bi solder. At the same time, adding 2 wt.% In and 2 wt.% Ag to the Sn-58Bi solder reduced the melting temperature of the composite solder from 143.75 ∘ C to 133.59 ∘ C. Zhang et al [34] pointed out that the effects of the 0.3 wt.% and 1.0 wt.% Ag addition on the solid phase line temperature of the Sn35Bi solder were slight because the solid phase line temperatures of the Sn35Bi, Sn35Bi0.3Ag, and Sn35Bi1.0Ag composite solders were 138.5 ∘ C, 138.8 ∘ C, and 138.9 ∘ C, respectively. But the liquidus temperature of the above solders was 150.3 ∘ C, 183.6 ∘ C, and 184 ∘ C; it could be seen that the effects of the 0.3 wt.% and 1.0 wt.% Ag addition on the liquidus temperature were obvious.…”

Section: Soldermentioning

confidence: 99%

“…Chen et al [33] studied the wettability of Sn-Bi-3Zn ( = 37, 38,39,41,42,43) and Sn-38Bi-Zn ( = 0, 23, 4) at 170 ∘ C and 190 ∘ C. At 170 ∘ C, the spreading ratio was increased from 68% to 72% with the Bi element increased; but the spreading ratio was decreased from 75.8% to 66% and then increased to 72.7% with the Zn element increased. At 190 ∘ C, the spreading ratio of the Sn-Bi-3Zn alloys was decreased from 73.2% to 72% and then increased to 73.3% and it was higher than that at 170 ∘ C. However, the spreading ratio of the Sn-38Bi-Zn alloys changed slightly remaining 72% at 190 ∘ C. The wettability of the Sn-58Bi, Sn-35Bi-0.5Ag, and Sn-35Bi-1.0Ag was investigated by Zhang et al [34]. The above three solders with different fluxes showed different wettability with air and N 2 atmosphere.…”

Section: Wettabilitymentioning

confidence: 99%

“…At the same time, Liu and Shang [94] found that aging promoted Bi segregation to the Cu-intermetallic interface resulting in a sharp decrease in fatigue and fracture resistance of the interface. The fatigue life of the Sn-58Bi, Sn-35Bi-0.3Ag, and Sn-35Bi-1.0Ag was studied by Zhang et al [34]. The results exhibited that the fatigue life of the Sn-35Bi solder with 0.5 wt.% and 1.0 wt.% Ag was increased by 13.75% and 20%, respectively, compared with that of the Sn-58Bi solder.…”

Section: Reliabilitymentioning

confidence: 99%

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Properties and Microstructures of Sn-Bi-X Lead-Free Solders

Yang

Zhang

Liu

et al. 2016

Advances in Materials Science and Engineering

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The Sn-Bi base lead-free solders are proposed as one of the most popular alloys due to the low melting temperature (eutectic point: 139°C) and low cost. However, they are not widely used because of the lower wettability, fatigue resistance, and elongation compared to traditional Sn-Pb solders. So the alloying is considered as an effective way to improve the properties of Sn-Bi solders with the addition of elements (Al, Cu, Zn, Ga, Ag, In, Sb, and rare earth) and nanoparticles. In this paper, the development of Sn-Bi lead-free solders bearing elements and nanoparticles was reviewed. The variation of wettability, melting characteristic, electromigration, mechanical properties, microstructures, intermetallic compounds reaction, and creep behaviors was analyzed systematically, which can provide a reference for investigation of Sn-Bi base solders.

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Section: Soldermentioning

confidence: 99%

Section: Wettabilitymentioning

confidence: 99%

Section: Reliabilitymentioning

confidence: 99%

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Properties and Microstructures of Sn-Bi-X Lead-Free Solders

Yang

Zhang

Liu

et al. 2016

Advances in Materials Science and Engineering

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“…Other important Pb-free alloys include components like Cu, Bi, Zn, In, and Sb. Some of these have shown promising results, like lower melting points Metals 2020, 10, 370 2 of 11 than Sn-Pb; however, the inherent brittleness of Bi, the scarcity of In in the earth's crust, the mild toxicity of Sb, and the oxidation issues associated with Zn have prevented their application [7,8,[11][12][13][14][15][16]. Among these binary alloys, the Sn-Cu alloy seems to be a great candidate because of its cheaper price, absence of harmful Ag 3 Sn IMCs, and good wetting.…”

Section: Introductionmentioning

confidence: 99%

Solderability, Microstructure, and Thermal Characteristics of Sn-0.7Cu Alloy Processed by High-Energy Ball Milling

Sharma

Chae

et al. 2020

Metals

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In this work, we have investigated the role of high-energy ball milling (HEBM) on the evolution of microstructure, thermal, and wetting properties of an Sn-0.7Cu alloy. We ball-milled the constituent Sn and Cu powders in eutectic composition for 45 h. The microstructural studies were carried out using optical and scanning electron microscopy. The melting behavior of the powder was examined using differential scanning calorimetry (DSC). We observed a considerable depression in the melting point of the Sn-0.7Cu alloy (≈7 °C) as compared to standard cast Sn-0.7Cu alloys. The resultant crystallite size and lattice strain of the ball-milled Sn-0.7Cu alloy were 76 nm and 1.87%, respectively. The solderability of the Sn-0.7Cu alloy was also improved with the milling time, due to the basic processes occurring during the HEBM.

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“…One of the most promising Sn-Bi solder with low Bi content is Sn-35Bi-1Ag alloy because it possesses a comparable melting point as Sn-Pb eutectic solder. The microstructure and tensile properties of solder, wetting kinetics of solder on Cu, interfacial reaction in solder joints and thermal cycling reliability were then studied [15][16][17][18]. However, Sn-35Bi-1Ag solder still exhibited lower tensile and ductility [19].On the other hand, to improve the properties of Sn-Bi solder, many researchers tried to incorporate the alloying elements into Sn-58Bi eutectic solder.…”

mentioning

confidence: 99%

Comprehensive Properties of a Novel Quaternary Sn-Bi-Sb-Ag Solder: Wettability, Interfacial Structure and Mechanical Properties

Wang

Huang

et al. 2019

Metals

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Sn-58Bi eutectic solder is the most recommended low temperature Pb-free solder but is also limited from the interfacial embrittlement of Bi segregation. Since the quaternary Sn-38Bi-1.5Sb-0.7Ag solder provides a similar melting point as Sn-58Bi eutectic, this paper systematically investigated the properties of this solder from wettability, bulk tensile properties, interfacial microstructure in solder joints with a Cu substrate, interfacial evolution in joints during isothermal aging and the shear strength on ball solder joints with effect of aging conditions. The results were also compared with Sn-58Bi solder. The wettability of solder alloys was evaluated with wetting balance testing, and the quaternary Sn-38Bi-1.5Sb-0.7Ag solder had a better wettability than Sn-58Bi solder on the wetting time. Tensile tests on bulk solder alloys indicated that the quaternary Sn-38Bi-1.5Sb-0.7Ag solder had a higher tensile strength and similar elongation compared with Sn-58Bi solder due to the finely distributed SnSb and Ag 3 Sn intermetallics in the solder matrix. The tensile strength of solder decreased with a decrease in the strain rate and with an increase in temperature, while the elongation of solder was independent of the temperature and strain rate. When soldering with a Cu substrate, a thin Cu 6 Sn 5 intermetallic compound (IMC) is produced at the interface in the solder joint. Measurement on IMC thickness showed that the quaternary Sn-38Bi-1.5Sb-0.7Ag had a lower IMC growth rate during the following isothermal aging. Ball shear test on solder joints illustrated that the quaternary Sn-38Bi-1.5Sb-0.7Ag solder joints had higher shear strength than Sn-58Bi solder joints. Compared with the serious deterioration on shear strength of Sn-58Bi joints from isothermal aging, the quaternary Sn-38Bi-1.5Sb-0.7Ag solder joints presented a superior high temperature stability. Therefore, the quaternary Sn-38Bi-1.5Sb-0.7Ag solder provides better performances and the possibility to replace Sn-58Bi solder to realize low temperature soldering.Metals 2019, 9, 791 2 of 12 usually above 245 • C, promotes thermal warpage on a PCB and thinner components [3]. Therefore, the development of low temperature solder provides a lower processing temperature, and therefore reduces the thermal damage caused from using high-temperature solders. Currently, the developed low-temperature solders are mainly selected from the Sn-Bi, Sn-In or Sn-Zn series [4]; but Sn-Bi solder provides the most potential due to its low cost and better comprehensive properties [5].The Sn-Bi binary solder system can reach the low eutectic temperature at 138 • C with a composition of Sn-58Bi, which provides the ideal processing temperature. However, there still exists some serious concerns on the application of Sn-58Bi eutectic solder, such as the interfacial embrittlement in solder joints [6][7][8][9], poorer drop reliability [10], the deterioration on joint strength after aging service [11], etc. All these problems are mainly attributed to the inherent embrittlement of Bi atoms....

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Microstructures and properties of Sn58Bi, Sn35Bi0.3Ag, Sn35Bi1.0Ag solder and solder joints

Cited by 34 publications

References 17 publications

Properties and Microstructures of Sn-Bi-X Lead-Free Solders

Properties and Microstructures of Sn-Bi-X Lead-Free Solders

Solderability, Microstructure, and Thermal Characteristics of Sn-0.7Cu Alloy Processed by High-Energy Ball Milling

Comprehensive Properties of a Novel Quaternary Sn-Bi-Sb-Ag Solder: Wettability, Interfacial Structure and Mechanical Properties

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