2019
DOI: 10.1049/iet-pel.2018.5418
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Modelling parallel SiC MOSFETs: thermal self‐stabilisation vs. switching imbalances

Abstract: This article presents a numerical method in combination with a device simulation model used to analyse the parallel connection of several silicon carbide (SiC) metal oxide semiconductor field effect transistor (MOSFET) dies. Parallel connection is necessary to achieve the desired current carrying capability of the main inverters for xEV-drives. With this method, the effect of asymmetries within the chips' parameters, especially the gate threshold voltage, is investigated. The investigation results quantify to … Show more

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Cited by 17 publications
(6 citation statements)
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“…Based on the coupled inductance equivalent model established above, the output current change rate of the converter flux mutual aid and flux cancellation coupled inductance is expressed by Equations ( 18) and (19).…”
Section: The Operational Principle Of the Coupled Inductancementioning
confidence: 99%
See 1 more Smart Citation
“…Based on the coupled inductance equivalent model established above, the output current change rate of the converter flux mutual aid and flux cancellation coupled inductance is expressed by Equations ( 18) and (19).…”
Section: The Operational Principle Of the Coupled Inductancementioning
confidence: 99%
“…Many studies have been performed on the imbalance of current suppression. From the view of the study object, the imbalance current suppression method can be classified into three categories: device classification; device operating condition monitoring; and circuit topology [14][15][16][17][18][19]. The chip screening method is proposed to solve the mismatch introduced by the asymmetric layout [20].…”
Section: Introductionmentioning
confidence: 99%
“…However, manufacturers still have to use relatively small die sizes to achieve reasonable product yields [7]. Thus, despite the superior properties of SiC as a base material, in practice SiC MOSFETs must be parallelised to achieve the current levels demanded [8][9][10][11].…”
Section: Introductionmentioning
confidence: 99%
“…In addition, it is much harder to grow silica on SiC than on silicon substrates [14]. This poses a substantial challenge for the fabrication of MOS structures and results in, for example, a wider than desirable dispersion of threshold voltages among different devices of the same model [11,15,16]. Therefore, effective switching synchronisation is crucial for reliable parallelisation of SiC MOSFETs.…”
Section: Introductionmentioning
confidence: 99%
“…Generally, three approaches are considered to solve the imbalance current sharing problem in literatures [6][7][8][9][10][11][12][13][14][15][16][17][18]. In [6][7][8], authors try to present a manufacturing approach to produce MOSFET devices with the same parameters. However, this approach is rather hard and costly.…”
Section: Introductionmentioning
confidence: 99%