Nanomechanical characterization of Sn–Ag–Cu/Cu joints—Part 2: Nanoindentation creep and its relationship with uniaxial creep as a function of temperature

Strain rate sensitivity of Sn–3.0Ag–0.5Cu solder investigated by nanoindentation

“…Among the numerous environmentally friendly leadfree solders, SnAgCu system solder alloy with its excellent mechanical properties and solder joint quality is of particular interest [1][2][3][4]. Given the complex service conditions of electronic products, research on the fracture and deformation behaviors [3][4][5][6], nanomechanical properties as a function of temperature [5][6][7][8][9][10] have been performed for lead-free solders recently. Further, the aim of the current study is to investigate the strain rate sensitivity of SnAgCu solder using nanoindentation.…”

Creep-related micromechanical behavior of zirconia-based ceramics investigated by nanoindentation

“…Consequently, creep characteristics are more obvious during the holding stage. At low _ P=P, the time needed to reach the preset indentation depth may be sufficiently long for creep deformation to occur, which would weaken the creep behavior during the holding time [16]. Thus, shorter holding times lead to a more obvious loading rate effect on the creep behavior, as shown in Fig.…”

“…It can be interpreted by the different microstructures and a mass of dislocations combining with grain boundaries sliding throughout several grains due to the higher locally stress beneath the indenter with very small contacting area [16].…”

“…It is difficult to measure the stress during nanoindentation tests. However, the creep process correlates with the rate of the yield boundaries extending to the inner structure [32,33], and the classic Tabor relationship is often applied to relate hardness to equivalent stress [34,35]. Hence, Eq.…”

“…Based on the application of nanoindentation on studying elasticoplastic deformation, some researchers attempted to utilize such technique to investigate time-dependent deformation (i.e., creep) behavior [11,12]. Additionally, the stress exponents obtained by the nanoindentation technique have been found in general agree with those from conventional creep tests because the underpinning deformation mechanism was the same in a wide range of materials [13][14][15][16]. These consistencies were useful to measure micromechanical creep deformation and also gave an attraction of understanding the deformation mechanisms of the materials by nanoindentation [17].…”