Abstract-We use depth-resolved cathodoluminescence spectroscopy (DRCLS), Kelvin probe force microscopy (KPFM), and surface photovoltage spectroscopy (SPS) on a nanometer scale to map the temperature, strain, and defects inside GaN highelectron-mobility transistors. DRCLS maps temperature at localized depths, particularly within the 2-D electron gas region during device operation. KPFM maps surface electric potential across the device, revealing lower potential patches that decrease rapidly with increasing OFF-state stress. CL spectra acquired at these patches exhibit defect emissions that increase with both ONand OFF-state stresses and that increase with decreasing surface potential. SPS also reveals features of deep level gap states generated after device operation that reduce near-band-edge emission and increase surface band bending. Our nanoscale measurements are consistent with defect generation by inverse piezoelectric fieldinduced stress at the gate edge on the drain side at high voltage.Index Terms-AlGaN/GaN high-electron-mobility transistor (HEMT), defect characterization, depth-resolved cathodoluminescence spectroscopy (DRCLS), HEMT, Kelvin force probe microscopy, strain mapping, surface photovoltage spectroscopy (SPS), temperature mapping.