2018 48th European Solid-State Device Research Conference (ESSDERC) 2018
DOI: 10.1109/essderc.2018.8486897
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Novel Back Gate Doping Ultra Low Retention Power 22nm FDSOl SRAM for IOT Application

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Cited by 2 publications
(4 citation statements)
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“…Hence, we conclude that the partitioned FECC is a very effective way to lower the DRV. This work shows that advanced design techniques for SRAM can lower memory energy consumption to the levels that are needed for biomedical platforms and eventually other IoT, low energy, applications 2 Suffix P uses a push-rule cell 3 Estimated from graph 4 Prec, at 38 kHz access rate and with size compensation, but only taking the leakage power of the other banks into account, not the dynamic power overhead of the long datalines, crossing multiple banks.…”
Section: Discussionmentioning
confidence: 99%
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“…Hence, we conclude that the partitioned FECC is a very effective way to lower the DRV. This work shows that advanced design techniques for SRAM can lower memory energy consumption to the levels that are needed for biomedical platforms and eventually other IoT, low energy, applications 2 Suffix P uses a push-rule cell 3 Estimated from graph 4 Prec, at 38 kHz access rate and with size compensation, but only taking the leakage power of the other banks into account, not the dynamic power overhead of the long datalines, crossing multiple banks.…”
Section: Discussionmentioning
confidence: 99%
“…Aggressive stand-by voltage scaling with foundry macros is possible, but limited to around 400mV in 28-22 nm technologies due to local process variation [3], [16], even with the low variation promised in the 22nm FD-SOI technology [9]. In this voltage range, the macros are in near-threshold operation.…”
Section: A Lower Retention Voltagementioning
confidence: 99%
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“…More than half of the energy budget is due to memory [5], [6]. Bearing in mind the low-speed recording application, the use of a lower-voltage custom SRAM is preferred over a high-speed foundry SRAM [7], [8]. However, aggressive voltage scaling requirements tend to dramatically increase transistor variation.…”
Section: Introductionmentioning
confidence: 99%